Heitzer; Ludwig

Patent Applications and Registrations

Patent applications and USPTO patent grants for Heitzer; Ludwig.The latest application filed is for "tilted chip assembly for optical devices".

Company Profile

5.21.22

Heitzer; Ludwig - Falkenfels DE
- Falkenfels DE
Heitzer; Ludwig - Falkensfels DE
Heitzer; Ludwig - Regensburg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Tilted chip assembly for optical devices Grant 10,571,682 - Heitzer , et al. Feb	2020-02-25
Tilted chip assembly for optical devices Grant 10539779 -	2020-01-21
Semiconductor battery and semiconductor device including a semiconductor battery Grant 10,424,819 - Ehm , et al. Sept	2019-09-24
Tilted Chip Assembly For Optical Devices App 20190049716 - HEITZER; Ludwig ; et al.	2019-02-14
Semiconductor device and method of manufacture thereof Grant 10,043,768 - Meyer , et al. August 7, 2	2018-08-07
Method for attaching a semiconductor die to a carrier Grant 9,881,909 - Bauer , et al. January 30, 2	2018-01-30
Semiconductor Battery and Semiconductor Device Including a Semiconductor Battery App 20170271722 - Ehm; Hans ; et al.	2017-09-21
Method for fabricating a semiconductor package and semiconductor package Grant 9,576,935 - Bauer , et al. February 21, 2	2017-02-21
Semiconductor Device and Method of Manufacture Thereof App 20160379945 - MEYER; Thorston ; et al.	2016-12-29
Method for Attaching a Semiconductor Die to a Carrier App 20160126227 - Bauer; Michael ; et al.	2016-05-05
Method for Fabricating a Semiconductor Package and Semiconductor Package App 20150303135 - Bauer; Michael ; et al.	2015-10-22
Semiconductor device and method of manufacture thereof Grant 9,030,019 - Meyer , et al. May 12, 2	2015-05-12
Device including an encapsulated semiconductor chip and manufacturing method thereof Grant 8,421,226 - Meyer , et al. April 16, 2	2013-04-16
Electronic component of VQFN design and method for producing the same Grant 8,330,260 - Bauer , et al. December 11, 2	2012-12-11
Semiconductor Device and Method of Manufacture Thereof App 20120146231 - Meyer; Thorsten ; et al.	2012-06-14
Electronic device and method of manufacturing same Grant 8,173,488 - Bauer , et al. May 8, 2	2012-05-08
Device Including an Encapsulated Semiconductor Chip and Manufacturing Method Thereof App 20110204513 - Meyer; Thorsten ; et al.	2011-08-25
Plastic housing and semiconductor component with said plastic housing Grant 7,919,857 - Bauer , et al. April 5, 2	2011-04-05
Method for manufacturing an electronic component and corresponding electronic component Grant 7,834,460 - Bauer , et al. November 16, 2	2010-11-16
Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip Grant 7,749,864 - Bauer , et al. July 6, 2	2010-07-06
Electronic circuit in a package-in-package configuration and production method Grant 7,714,416 - Bauer , et al. May 11, 2	2010-05-11
Electronic Device and Method of Manufacturing Same App 20100078822 - BAUER; Michael ; et al.	2010-04-01
Module with a shielding and/or heat dissipating element Grant 7,683,460 - Heitzer , et al. March 23, 2	2010-03-23
Electronic circuit in a package-on-package configuration and method for producing the same Grant 7,662,664 - Bauer , et al. February 16, 2	2010-02-16
Method for applying a structure of joining material to the back surfaces of semiconductor chips Grant 7,592,236 - Bauer , et al. September 22, 2	2009-09-22
Method for coating a structure comprising semiconductor chips Grant 7,547,645 - Bauer , et al. June 16, 2	2009-06-16
Semiconductor device with semiconductor chip and adhesive film and method for producing the same Grant 7,470,601 - Bauer , et al. December 30, 2	2008-12-30
Semiconductor Device With A Thinned Semiconductor Chip And Method For Producing The Thinned Semiconductor Chip App 20080242057 - Bauer; Michael ; et al.	2008-10-02
Layer For Chip Contact Element App 20080079175 - Bauer; Michael ; et al.	2008-04-03
Module with a shielding and/or heat dissipating element App 20080073756 - Heitzer; Ludwig ; et al.	2008-03-27
Multi-chip Assembly App 20080054451 - Bauer; Michael ; et al.	2008-03-06
Plastic Housing and Semiconductor Component with Said Plastic Housing and Method for Producing the Same App 20080045063 - Bauer; Michael ; et al.	2008-02-21
Electronic Device and Method For Producing the Same App 20080029865 - Bauer; Michael ; et al.	2008-02-07
Electronic Circuit in a Package-On-Package Configuration and Method for Producing the Same App 20080017967 - Bauer; Michael ; et al.	2008-01-24
Electronic Circuit In A Package-in-package Configuration And Production Method App 20080017972 - Bauer; Michael ; et al.	2008-01-24
Electronic Component of VQFN Design and Method for Producing the Same App 20080017986 - Bauer; Michael ; et al.	2008-01-24
Method for manufacturing an electronic component and corresponding electronic component App 20070290346 - Bauer; Michael ; et al.	2007-12-20
Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip Grant 7,294,916 - Bauer , et al. November 13, 2	2007-11-13
Method for coating a structure comprising semiconductor chips App 20070105394 - Bauer; Michael ; et al.	2007-05-10
Method for applying a structure of joining material to the back surfaces of semiconductor chips App 20070087532 - Bauer; Michael ; et al.	2007-04-19
Semiconductor device with semiconductor chip and adhesive film and method for producing the same App 20070082463 - Bauer; Michael ; et al.	2007-04-12
Semiconductor Device With A Thinned Semiconductor Chip And Method For Producing The Thinned Semiconductor Chip App 20070042568 - Bauer; Michael ; et al.	2007-02-22

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