Heitzer, Josef

Patent Applications and Registrations

Patent applications and USPTO patent grants for Heitzer, Josef.The latest application filed is for "nonconducting substrate, forming a strip or a panel, on which a multiplicity of carrier elements are formed".

Company Profile

0.8.2

Heitzer, Josef - Bach/Donau DE
Heitzer; Josef - Bach DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Nonconducting substrate, forming a strip or a panel, on which a multiplicity of carrier elements are formed App 20040256150 - Barchmann, Bernd ; et al.	2004-12-23
Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the two Grant 6,806,562 - Barchmann , et al. October 19, 2	2004-10-19
Carrier element for a semiconductor chip for incorporation into smart cards Grant 6,719,205 - Puschner , et al. April 13, 2	2004-04-13
Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the two App 20020113311 - Barchmann, Bernd ; et al.	2002-08-22
Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate Grant 6,313,524 - Pueschner , et al. November 6, 2	2001-11-06
Chip module, in particular for implantation in a smart card body Grant 6,288,904 - Houdeau , et al. September 11, 2	2001-09-11
Smart card module and smart card including a smart card module Grant 6,191,951 - Houdeau , et al. February 20, 2	2001-02-20
Microprocessor, in particular for use in a chip card, with a control unit and with a housing surrounding the control unit Grant 6,185,507 - Huber , et al. February 6, 2	2001-02-06
Method for producing a carrier element for semiconductor chips Grant 6,088,901 - Huber , et al. July 18, 2	2000-07-18
Method for electrically connecting a semiconductor chip to at least one contact surface and smart card module and smart card produced by the method Grant 5,874,354 - Heitzer , et al. February 23, 1	1999-02-23

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