loadpatents
Patent applications and USPTO patent grants for Heistand; Robert II.The latest application filed is for "plated terminations and method of forming using electrolytic plating".
Patent | Date |
---|---|
Plated terminations and method of forming using electrolytic plating App 20070014075 - Ritter; Andrew P. ;   et al. | 2007-01-18 |
Plated terminations App 20050146837 - Ritter, Andrew P. ;   et al. | 2005-07-07 |
Plated terminations App 20050046536 - Ritter, Andrew P. ;   et al. | 2005-03-03 |
Component formation via plating technology App 20040264105 - Galvagni, John L. ;   et al. | 2004-12-30 |
Plated terminations App 20040257748 - Ritter, Andrew P. ;   et al. | 2004-12-23 |
Plated terminations App 20040218344 - Ritter, Andrew P. ;   et al. | 2004-11-04 |
Plated terminations App 20040218373 - Ritter, Andrew P. ;   et al. | 2004-11-04 |
Component formation via plating technology App 20040197973 - Ritter, Andrew P. ;   et al. | 2004-10-07 |
Plated terminations App 20040090732 - Ritter, Andrew P. ;   et al. | 2004-05-13 |
Cascade capacitor App 20040057192 - Galvagni, John L. ;   et al. | 2004-03-25 |
Component formation via plating technology App 20040022009 - Galvagni, John L. ;   et al. | 2004-02-05 |
Plated terminations App 20030231457 - Ritter, Andrew P. ;   et al. | 2003-12-18 |
Cascade capacitor App 20030072125 - Galvagni, John L. ;   et al. | 2003-04-17 |
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