Heinen; Katherine G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Heinen; Katherine G..The latest application filed is for "ball grid assembly with solder columns".

Company Profile

0.10.2

Heinen; Katherine G. - Dallas TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer-scale assembly of chip-size packages Grant 6,730,541 - Heinen , et al. May 4, 2	2004-05-04
Ball grid assembly with solder columns App 20030027415 - Heinen, Katherine G.	2003-02-06
Wafer-scale assembly of chip-size packages Grant 6,432,744 - Amador , et al. August 13, 2	2002-08-13
Wafer-scale Assemby Of Chip-size Packages App 20010044197 - HEINEN, KATHERINE G. ; et al.	2001-11-22
Ball grid assembly with solder columns Grant 6,251,767 - Heinen June 26, 2	2001-06-26
Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid Grant 5,458,716 - Alfaro , et al. October 17, 1	1995-10-17
Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation Grant 5,442,233 - Anjoh , et al. August 15, 1	1995-08-15
Technique for enhancing adhesion capability of heat spreaders in molded packages Grant 5,422,788 - Heinen , et al. June 6, 1	1995-06-06
Integrated circuit device and method to prevent cracking during surface mount Grant 5,418,189 - Heinen May 23, 1	1995-05-23
Insulated lead frame for integrated circuits and method of manufacture thereof Grant 5,359,224 - Heinen , et al. October 25, 1	1994-10-25
Multi-chip module testing Grant 5,321,277 - Sparks , et al. June 14, 1	1994-06-14
Balanced capacitance lead frame for integrated circuits and integrated circuit device with separate conductive layer Grant 5,233,220 - Lamson , et al. August 3, 1	1993-08-03

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