Heimink; Jan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Heimink; Jan.The latest application filed is for "pressure sensitive adhesive assembly suitable for bonding to uneven substrates".

Company Profile

4.3.8

Heimink; Jan - Schwelm DE
Heimink; Jan - Witten DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pressure sensitive adhesive assembly comprising thermoplastic filler material Grant 11,332,648 - Heimink , et al. May 17, 2	2022-05-17
Pressure sensitive adhesive assembly suitable for bonding to uneven substrates Grant 10,633,495 - Heimink , et al.	2020-04-28
Pressure Sensitive Adhesive Assembly Suitable For Bonding To Uneven Substrates App 20200062912 - Heimink; Jan ; et al.	2020-02-27
Pressure sensitive adhesive assembly suitable for bonding to uneven substrates Grant 10,501,591 - Heimink , et al. Dec	2019-12-10
Multilayer Pressure Sensitive Adhesive Foam Tape For Outdoor Applications App 20190194501 - Eckhardt; Doreen ; et al.	2019-06-27
Post-curable Precursor Of An Acrylic-based Pressure-sensitive Adhesive App 20180312734 - Heimink; Jan ; et al.	2018-11-01
Multilayer Pressure Sensitive Adhesive Foam Tape For Outdoor Applications App 20180298236 - Eckhardt; Doreen ; et al.	2018-10-18
Multilayer Hollow Body Having High Leaching Resistance App 20180080586 - BERGER; Jasmin ; et al.	2018-03-22
Pressure Sensitive Adhesive Assembly Suitable For Bonding To Uneven Substrates App 20170210950 - Heimink; Jan ; et al.	2017-07-27
Pressure Sensitive Adhesive Assembly Comprising Thermoplastic Filler Material App 20170130101 - Heimink; Jan ; et al.	2017-05-11
Pressure Sensitive Adhesive Assembly Comprising Filler Material App 20160083628 - Heimink; Jan ; et al.	2016-03-24

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