Heim; Dorothy A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Heim; Dorothy A..The latest application filed is for "high-density bond pad layout arrangements for semiconductor dies, and connecting to the bond pads".
- Heim; Dorothy A. - San Jose CA
| Patent | Date |
|---|---|
| High-density bond pad layout arrangements for semiconductor dies, and connecting to the bond pads Grant 5,635,424 - Rostoker , et al. June 3, 1 | 1997-06-03 |
| Method of laying out bond pads on a semiconductor die Grant 5,441,917 - Rostoker , et al. August 15, 1 | 1995-08-15 |
| Semiconductor die having a high density array of composite bond pads Grant 5,404,047 - Rostoker , et al. April 4, 1 | 1995-04-04 |
| Semiconductor bond pads Grant 5,284,797 - Heim February 8, 1 | 1994-02-08 |
| Composite bond pads for semiconductor devices Grant 5,248,903 - Heim September 28, 1 | 1993-09-28 |
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