HEILMAIER; Alexander

Patent Applications and Registrations

Patent applications and USPTO patent grants for HEILMAIER; Alexander.The latest application filed is for "method for polishing a semiconductior wafer".

Company Profile

1.6.8

HEILMAIER; Alexander - Haiming DE
Heilmaier; Alexander - Marktl DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Polishing A Semiconductior Wafer App 20220080549 - HEILMAIER; Alexander ; et al.	2022-03-17
Method for polishing a semiconductor wafer Grant 10,189,142 - Roettger , et al. Ja	2019-01-29
Method for polishing semiconductor wafers by means of simultaneous double-side polishing Grant 9,221,149 - Baumann , et al. December 29, 2	2015-12-29
Method For Polishing Semiconductor Wafers By Means Of Simultaneous Double-side Polishing App 20140308878 - Baumann; Rainer ; et al.	2014-10-16
Method For Polishing A Semiconductor Wafer App 20140206261 - Roettger; Klaus ; et al.	2014-07-24
Process For Polishing A Semiconductor Wafer, Comprising The Simultaneous Polishing Of A Front Side And Of A Reverse Side Of A Substrate Wafer App 20140141613 - Heilmaier; Alexander ; et al.	2014-05-22
Method for producing a semiconductor wafer Grant 8,242,020 - Roettger , et al. August 14, 2	2012-08-14
Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers Grant 7,766,724 - Huber , et al. August 3, 2	2010-08-03
Method For Producing A Semiconductor Wafer App 20100055908 - Roettger; Klaus ; et al.	2010-03-04
Method For Simultaneously Slicing At Least Two Cylindrical Workpieces Into A Multiplicity Of Wafers App 20080099006 - Huber; Anton ; et al.	2008-05-01
Method For Removing Material From A Semiconductor Wafer App 20060211338 - Heilmaier; Alexander ; et al.	2006-09-21
Method for removing material from a semiconductor wafer Grant 7,108,583 - Heilmaier , et al. September 19, 2	2006-09-19
Double-sided polishing process for producing a multiplicity of silicon semiconductor wafers Grant 6,861,360 - Wenski , et al. March 1, 2	2005-03-01
Silicon semiconductor wafer, and process for producing a multiplicity of semiconductor wafers App 20030109139 - Wenski, Guido ; et al.	2003-06-12

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