Heidenblut; Maria
Patent Applications and Registrations
Patent applications and USPTO patent grants for Heidenblut; Maria.The latest application filed is for "semiconductor chip having a crack stop structure".
- Heidenblut; Maria - Schwarzenfeld DE
| Patent | Date |
|---|---|
| Semiconductor Chip Having A Crack Stop Structure App 20220270985 - Ananiev; Sergey ; et al. | 2022-08-25 |
| Wafer and method for processing a wafer Grant 10,600,701 - Mackh , et al. | 2020-03-24 |
| Wafer And Method For Processing A Wafer App 20180374766 - Mackh; Gunther ; et al. | 2018-12-27 |
| Wafer and method for processing a wafer Grant 10,090,214 - Mackh , et al. October 2, 2 | 2018-10-02 |
| Singulation processes Grant 9,040,389 - Mackh , et al. May 26, 2 | 2015-05-26 |
| Wafer And Method For Processing A Wafer App 20140103495 - Mackh; Gunther ; et al. | 2014-04-17 |
| Singulation Processes App 20140099777 - Mackh; Gunther ; et al. | 2014-04-10 |
| Method of etching a material surface Grant 8,183,156 - Heidenblut , et al. May 22, 2 | 2012-05-22 |
| Method of Etching a Material Surface App 20090305510 - Heidenblut; Maria ; et al. | 2009-12-10 |
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