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Patent applications and USPTO patent grants for Hedtke, Jr.; Louis R..The latest application filed is for "weight material dispensing, cutting and applying system".
Patent | Date |
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Weight material dispensing and cutting system Grant 10,603,805 - Compton , et al. | 2020-03-31 |
Weight Material Dispensing, Cutting and Applying System App 20180031438 - COMPTON; Mark A. ;   et al. | 2018-02-01 |
Weight material dispensing, cutting and applying system Grant 9,784,636 - Hedtke, Jr. , et al. October 10, 2 | 2017-10-10 |
Weight Material Dispensing And Cutting System App 20170225347 - COMPTON; Mark A. ;   et al. | 2017-08-10 |
Weight material dispensing and cutting system Grant 9,630,335 - Hedtke, Jr. , et al. April 25, 2 | 2017-04-25 |
Weight Material Dispensing and Cutting System App 20160193745 - HEDTKE, JR.; Louis R. ;   et al. | 2016-07-07 |
Weight material dispensing and cutting system Grant 9,290,289 - Hedtke, Jr. , et al. March 22, 2 | 2016-03-22 |
Weight Material Dispensing, Cutting and Applying System App 20150090032 - HEDTKE, JR.; Louis R. ;   et al. | 2015-04-02 |
Weight material dispensing, cutting, and applying system Grant 8,943,940 - Hedtke, Jr. , et al. February 3, 2 | 2015-02-03 |
Weight Material Dispensing And Cutting System App 20140000432 - HEDTKE, JR.; Louis R. ;   et al. | 2014-01-02 |
Weight Material Dispensing, Cutting, And Applying System App 20110283790 - Hedtke, JR.; Louis R. ;   et al. | 2011-11-24 |
Weight Material Dispensing And Cutting System App 20100175522 - HEDTKE, JR.; Louis R. ;   et al. | 2010-07-15 |
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