Hedrick; Jeffrey Curtis

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hedrick; Jeffrey Curtis.The latest application filed is for "transparent hard coats for optical elements".

Company Profile

0.26.18

Hedrick; Jeffrey Curtis - Park Ridge NJ
Hedrick; Jeffrey Curtis - Montvale NJ
Hedrick; Jeffrey Curtis - Peekskill NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Transparent hard coats for optical elements Grant 7,695,776 - Hedrick , et al. April 13, 2	2010-04-13
Transparent hard coats for optical elements App 20080286493 - Hedrick; Jeffrey Curtis ; et al.	2008-11-20
Transparent hard coats for optical elements Grant 7,378,146 - Hedrick , et al. May 27, 2	2008-05-27
Line level air gaps App 20060264036 - Chen; Shyng-Tsong ; et al.	2006-11-23
Multilayer interconnect structure containing air gaps and method for making Grant 7,098,476 - Babich , et al. August 29, 2	2006-08-29
Line level air gaps Grant 7,084,479 - Chen , et al. August 1, 2	2006-08-01
Line level air gaps App 20050127514 - Chen, Shyng-Tsong ; et al.	2005-06-16
Multilayer interconnect structure containing air gaps and method for making App 20050037604 - Babich, Katherina E. ; et al.	2005-02-17
Interconnects containing first and second porous low-k dielectrics separated by a porous buried etch stop layer Grant 6,831,366 - Gates , et al. December 14, 2	2004-12-14
Method for forming a porous dielectric material layer in a semiconductor device and device formed Grant 6,831,364 - Dalton , et al. December 14, 2	2004-12-14
Multilayer interconnect structure containing air gaps and method for making Grant 6,815,329 - Babich , et al. November 9, 2	2004-11-09
Multilevel interconnect structure containing air gaps and method for making Grant 6,737,725 - Grill , et al. May 18, 2	2004-05-18
Low k dielectric materials with inherent copper ion migration barrier Grant 6,730,618 - Cohen , et al. May 4, 2	2004-05-04
Spin-on cap layer, and semiconductor device containing same Grant 6,724,069 - Dalton , et al. April 20, 2	2004-04-20
Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics Grant 6,716,742 - Gates , et al. April 6, 2	2004-04-06
Interconnect structure with precise conductor resistance and method to form same Grant 6,710,450 - Gates , et al. March 23, 2	2004-03-23
Hybrid low-k interconnect structure comprised of 2 spin-on dielectric materials Grant 6,677,680 - Gates , et al. January 13, 2	2004-01-13
Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics App 20030183937 - Gates, Stephen McConnell ; et al.	2003-10-02
Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics Grant 6,603,204 - Gates , et al. August 5, 2	2003-08-05
Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics App 20030075803 - Gates, Stephen McConnell ; et al.	2003-04-24
Method for forming a porous dielectric material layer in a semiconductor device and device formed App 20030057414 - Dalton, Timothy Joseph ; et al.	2003-03-27
Multilayer interconnect structure containing air gaps and method for making App 20020158337 - Babich, Katherina E. ; et al.	2002-10-31
Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density App 20020160600 - Eckert, Andrew Robert ; et al.	2002-10-31
Spin-on cap layer, and semiconductor device containing same App 20020145200 - Dalton, Timothy Joseph ; et al.	2002-10-10
Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density Grant 6,455,443 - Eckert , et al. September 24, 2	2002-09-24
Method for forming a porous dielectric material layer in a semiconductor device and device formed Grant 6,451,712 - Dalton , et al. September 17, 2	2002-09-17
Multilevel interconnect structure containing air gaps and method for making App 20020127844 - Grill, Alfred ; et al.	2002-09-12
Low k dielectric materials with inherent copper ion migration barrier App 20020125549 - Cohen, Stephan Alan ; et al.	2002-09-12
Interconnect structure with precise conductor resistance and method to form same App 20020117737 - Gates, Stephen McConnell ; et al.	2002-08-29
Method for dual-damascene patterning of low-k interconnects using spin-on distributed hardmask App 20020119654 - Fornof, Ann Rhea-Helene ; et al.	2002-08-29
Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics App 20020117760 - Gates, Stephen McConnell ; et al.	2002-08-29
Hybrid low-k interconnect structure comprised of 2 spin-on dielectric materials App 20020117754 - Gates, Stephen McConnell ; et al.	2002-08-29
Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material Grant 6,413,852 - Grill , et al. July 2, 2	2002-07-02
Method for forming a porous dielectric material layer in a semiconductor device and device formed App 20020074659 - Dalton, Timothy Joseph ; et al.	2002-06-20
Low K Dielectric Materials With Inherent Copper Ion Migration Barrier App 20020033534 - COHEN, STEPHAN ALAN ; et al.	2002-03-21
High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer Grant 6,323,436 - Hedrick , et al. November 27, 2	2001-11-27
Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin Grant 6,225,373 - Gotro , et al. May 1, 2	2001-05-01
Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets Grant 6,093,636 - Carter , et al. July 25, 2	2000-07-25
Methods of fabrication of coaxial vias and magnetic devices Grant 5,898,991 - Fogel , et al. May 4, 1	1999-05-04
Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin Grant 5,834,537 - Gotro , et al. November 10, 1	1998-11-10
Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin Grant 5,827,907 - Gotro , et al. October 27, 1	1998-10-27
Process for making a foamed elastomeric polymer Grant 5,804,607 - Hedrick , et al. September 8, 1	1998-09-08
Process for making a foamed elastometric polymer Grant 5,726,211 - Hedrick , et al. March 10, 1	1998-03-10
Process for making a foamed polymer Grant 5,700,844 - Hedrick , et al. December 23, 1	1997-12-23

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