loadpatents
name:-0.0016779899597168
name:-0.0051519870758057
name:-0.00046110153198242
Heckmann; Klaus Patent Filings

Heckmann; Klaus

Patent Applications and Registrations

Patent applications and USPTO patent grants for Heckmann; Klaus.The latest application filed is for "methods of using adhesion enhancing layers and microelectronic integrated modules including adhesion enhancing layers".

Company Profile
0.5.1
  • Heckmann; Klaus - Pettendorf DE
  • Heckmann; Klaus - Regensburg DE
  • Heckmann; Klaus - D-8400 Regensburg DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Methods of using adhesion enhancing layers and microelectronic integrated modules including adhesion enhancing layers
Grant 6,787,242 - Atzesdorfer , et al. September 7, 2
2004-09-07
Porous ceramic
Grant 6,737,376 - Heckmann , et al. May 18, 2
2004-05-18
Methods of using adhesion enhancing layers and microelectronic integrated modules including adhesion enhancing layers
App 20030207114 - Atzesdorfer, Alexandra ;   et al.
2003-11-06
Process for the production of hyperfiltration membranes
Grant 4,873,033 - Heckmann , et al. October 10, 1
1989-10-10
Hyperfiltration membranes having separation layers of monomolecular films of surfactants
Grant 4,758,342 - Heckmann , et al. July 19, 1
1988-07-19

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