Heckaman; Douglas E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Heckaman; Douglas E..The latest application filed is for "phased array antenna having patch antenna elements with enhanced parasitic antenna element performance at millimeter wavelength radio frequency signals".

Company Profile

0.16.0

Heckaman; Douglas E. - Indialantic FL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Phased array antenna having patch antenna elements with enhanced parasitic antenna element performance at millimeter wavelength radio frequency signals Grant 6,421,012 - Heckaman July 16, 2	2002-07-16
Antenna horn and associated methods Grant 6,271,799 - Rief , et al. August 7, 2	2001-08-07
Phased array antenna having stacked patch antenna element with single millimeter wavelength feed and microstrip quadrature-to-circular polarization circuit Grant 6,266,015 - Heckaman , et al. July 24, 2	2001-07-24
Multi title-configured phased array antenna architecture Grant 6,166,705 - Mast , et al. December 26, 2	2000-12-26
Cross-over distribution scheme for canceling mutually coupled signals between adjacent stripline signal distribution networks Grant 6,130,585 - Whybrew , et al. October 10, 2	2000-10-10
Distributed ground pads for shielding cross-overs of mutually overlapping stripline signal transmission networks Grant 6,097,260 - Whybrew , et al. August 1, 2	2000-08-01
High isolation cross-over for canceling mutually coupled signals between adjacent stripline signal distribution networks Grant 6,028,494 - May , et al. February 22, 2	2000-02-22
Flat panel-configured electronically steerable phased array antenna having spatially distributed array of fanned dipole sub-arrays controlled by triode-configured field emission control devices Grant 5,835,062 - Heckaman , et al. November 10, 1	1998-11-10
Method of making a high speed, high density semiconductor memory package with chip level repairability Grant 5,122,475 - Heckaman , et al. June 16, 1	1992-06-16
Microwave chip carrier package having cover-mounted antenna element Grant 5,023,624 - Heckaman , et al. June 11, 1	1991-06-11
High speed, high density semiconductor memory package with chip level repairability Grant 5,014,114 - Heckaman , et al. May 7, 1	1991-05-07
Three-state, two-output variable RF power divider Grant 4,956,621 - Heckaman , et al. September 11, 1	1990-09-11
Impedance matched plug-in package for high speed microwave integrated circuits Grant 4,951,011 - Heckaman , et al. August 21, 1	1990-08-21
Waffleline - configured transmission link Grant 4,851,793 - Heckaman , et al. * July 25, 1	1989-07-25
Waffleline-configured microwave transmission link Grant 4,695,810 - Heckaman , et al. September 22, 1	1987-09-22
Miniaturized microwave transmission link Grant 4,641,140 - Heckaman , et al. February 3, 1	1987-02-03

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