Heckaman; Douglas
Patent Applications and Registrations
Patent applications and USPTO patent grants for Heckaman; Douglas.The latest application filed is for "interconnect structure for interconnecting electronic modules".
- Heckaman; Douglas - Indialantic FL
| Patent | Date |
|---|---|
| Interconnect structure for interconnecting electronic modules Grant 6,535,397 - Clark , et al. March 18, 2 | 2003-03-18 |
| Interconnect structure for interconnecting electronic modules App 20020180554 - Clark, William ; et al. | 2002-12-05 |
| High isolation integrated switch circuit Grant 5,272,457 - Heckaman , et al. December 21, 1 | 1993-12-21 |
| Hermetically sealed waffle-wall configured assembly including sidewall and cover radiating elements and a base-sealed waveguide window Grant 5,218,373 - Heckaman , et al. June 8, 1 | 1993-06-08 |
| Waffle wall-configured conducting structure for chip isolation in millimeter wave monolithic subsystem assemblies Grant 5,065,123 - Heckaman , et al. November 12, 1 | 1991-11-12 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 