Heck; John

Patent Applications and Registrations

Patent applications and USPTO patent grants for Heck; John.The latest application filed is for "iii-n multichip modules and methods of fabrication".

Company Profile

30.87.104

Heck; John - Berkeley CA
- Berkeley CA US
Heck; John - Mountain View CA US
Heck; John - Berkelay CA
Heck; John - Ostrander OH
Heck; John - Palo Alto CA
Heck; John - Mtn View CA
Heck; John - Mountainview CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Iii-n Multichip Modules And Methods Of Fabrication App 20220122842 - Ahmed; Khaled ; et al.	2022-04-21
Embedded Three-dimensional Electrode Capacitor App 20220084936 - QIAN; Wei ; et al.	2022-03-17
Optical receiver employing a metasurface collection lens having concentric belts or rings Grant 11,222,987 - Heck , et al. January 11, 2	2022-01-11
III-N multichip modules and methods of fabrication Grant 11,211,245 - Ahmed , et al. December 28, 2	2021-12-28
Iii-n Multichip Modules And Methods Of Fabrication App 20210375620 - Ahmed; Khaled ; et al.	2021-12-02
Mechanisms for refractive index tuning semiconductor photonic devices Grant 11,175,451 - Jayatilleka , et al. November 16, 2	2021-11-16
Heating of Thermo-Optic Device App 20210318561 - Sakib; Meer Nazmus ; et al.	2021-10-14
Multi-mode interference (MMI) based laser devices for heterogeneous platforms Grant 11,143,818 - Sakib , et al. October 12, 2	2021-10-12
Optical device including buried optical waveguides and output couplers Grant 10,996,408 - Heck , et al. May 4, 2	2021-05-04
Optical Coherent Receiver On A Chip App 20210119710 - Sakib; Meer Nazmus ; et al.	2021-04-22
Silicon Photonic Integrated Lens Compatible With Wafer Processing App 20210074866 - DOBRIYAL; Priyanka ; et al.	2021-03-11
Metasurface devices for display and photonics devices Grant 10,914,874 - Ahmed , et al. February 9, 2	2021-02-09
Semiconductor photonic devices using phase change materials Grant 10,877,352 - Heck , et al. December 29, 2	2020-12-29
Multi-layer Silicon Photonics Apparatus App 20200393619 - Mahalingam; Hari ; et al.	2020-12-17
Reflow compatible optical packaging Grant 10,816,737 - Heck , et al. October 27, 2	2020-10-27
Metasurface Devices For Display And Photonics Devices App 20200200951 - Ahmed; Khaled ; et al.	2020-06-25
Integrated Photonic Transceiver App 20200192026 - Heck; John ; et al.	2020-06-18
Mechanisms For Refractive Index Tuning Semiconductor Photonic Devices App 20200150344 - Jayatilleka; Hasitha ; et al.	2020-05-14
Metasurface devices for display and photonics devices Grant 10,564,330 - Ahmed , et al. Feb	2020-02-18
Optical Device Including Buried Optical Waveguides And Output Couplers App 20190339466 - Heck; John ; et al.	2019-11-07
Semiconductor Photonic Devices Using Phase Change Materials App 20190339585 - Heck; John ; et al.	2019-11-07
On-chip optical isolator Grant 10,466,515 - Heck , et al. No	2019-11-05
Multi-mode Interference (mmi) Based Laser Devices For Heterogeneous Platforms App 20190324210 - Sakib; Meer Nazmus ; et al.	2019-10-24
Monolithic physically displaceable optical waveguides Grant 10,310,196 - Hutchison , et al.	2019-06-04
Low power, high resolution solid state LIDAR circuit having a modulator to modulate a bit sequence onto a carrier frequency of a received optical signal Grant 10,281,322 - Doylend , et al.	2019-05-07
Reflow Compatible Optical Packaging App 20190121036 - Heck; John ; et al.	2019-04-25
Metasurface Devices For Display And Photonics Devices App 20190121004 - Ahmed; Khaled ; et al.	2019-04-25
Optical Receiver Employing A Metasurface Collection Lens App 20190044003 - Heck; John ; et al.	2019-02-07
Polymer Optical Coupler App 20190041582 - Heck; John ; et al.	2019-02-07
Low Power, High Resolution Solid State Lidar Circuit App 20180156661 - DOYLEND; Jonathan K. ; et al.	2018-06-07
Optical Iso-modulator App 20180059446 - Kim; Woosung ; et al.	2018-03-01
Feedback controlled closed loop on-chip isolator Grant 9,897,827 - Kim , et al. February 20, 2	2018-02-20
Feedback Controlled Closed Loop On-chip Isolator App 20180031873 - Kim; Woosung ; et al.	2018-02-01
Low power, high resolution solid state LIDAR circuit Grant 9,823,118 - Doylend , et al. November 21, 2	2017-11-21
Inverted 45.degree. mirror for photonic integrated circuits Grant 9,791,641 - Heck , et al. October 17, 2	2017-10-17
Opto-mechanical inertial sensor Grant 9,778,042 - Bramhavar , et al. October 3, 2	2017-10-03
On-chip Optical Isolator App 20170269395 - Heck; John ; et al.	2017-09-21
Low power, high resolution solid state lidar circuit App 20170184450 - Doylend; Jonathan K. ; et al.	2017-06-29
Solid state LIDAR circuit with waveguides tunable to separate phase offsets Grant 9,575,341 - Heck , et al. February 21, 2	2017-02-21
Apparatus, method and system for spectrometry with a displaceable waveguide structure Grant 9,500,827 - Hutchison , et al. November 22, 2	2016-11-22
Integrated silicon optomechanical gyroscopes (OMGs) Grant 9,482,535 - Heck , et al. November 1, 2	2016-11-01
Monolithic Physically Displaceable Optical Waveguides App 20160266331 - HUTCHISON; David N. ; et al.	2016-09-15
Opto-mechanical Inertial Sensor App 20160195397 - Bramhavar; Suraj ; et al.	2016-07-07
On-chip diffraction grating prepared by crystallographic wet-etch Grant 9,360,601 - Na , et al. June 7, 2	2016-06-07
Inverted 45 Degree Mirror For Photonic Integrated Circuits App 20160139350 - HECK; John ; et al.	2016-05-19
MEMS apparatus with a movable waveguide section Grant 9,341,644 - Hutchison , et al. May 17, 2	2016-05-17
Optomechanical inertial sensor Grant 9,285,391 - Hutchison , et al. March 15, 2	2016-03-15
CMOS-compatible gold-free contacts Grant 9,252,118 - Jain , et al. February 2, 2	2016-02-02
Optomechanical sensor for accelerometry and gyroscopy Grant 9,239,340 - Hutchison , et al. January 19, 2	2016-01-19
Solid State Lidar Circuit App 20150378187 - HECK; JOHN ; et al.	2015-12-31
Apparatus, Method And System For Spectrometry With A Displaceable Waveguide Structure App 20150377705 - Hutchison; David N. ; et al.	2015-12-31
Inverted 45 degree mirror for photonic integrated circuits Grant 9,195,007 - Heck , et al. November 24, 2	2015-11-24
Optomechanical Sensor For Accelerometry And Gyroscopy App 20150316580 - Hutchison; David N. ; et al.	2015-11-05
Semiconductor substrate for an optical receiver Grant 9,099,352 - Heck , et al. August 4, 2	2015-08-04
On-chip Diffraction Grating Prepared By Crystallographic Wet-etch App 20150185377 - Na; Yun-Chung ; et al.	2015-07-02
Optomechanical Inertial Sensor App 20150168442 - Hutchison; David N. ; et al.	2015-06-18
Optomechanical Sensor For Accelerometry And Gyroscopy App 20150168441 - Hutchison; David N. ; et al.	2015-06-18
Method and structure combining vertical and angled facets in silicon photonic waveguides Grant 9,042,696 - Heck , et al. May 26, 2	2015-05-26
On-chip diffraction grating prepared by crystallographic wet-etch Grant 8,970,956 - Na , et al. March 3, 2	2015-03-03
Hybrid Integration Of Group Iii-v Semiconductor Devices On Silicon App 20140307997 - Bar; Hanan ; et al.	2014-10-16
Vertical mirror in a silicon photonic circuit Grant 8,803,268 - Heck , et al. August 12, 2	2014-08-12
Seek-scan probe (SSP) memory with sharp probe tips formed at CMOS-compatible temperatures Grant 8,681,596 - Heck March 25, 2	2014-03-25
Cmos-compatible Gold-free Contacts App 20140050243 - Jain; Siddharth ; et al.	2014-02-20
Seek scan probe (SSP) cantilever to mover wafer bond stop Grant 8,644,125 - Chou , et al. February 4, 2	2014-02-04
Inverted 45 Degree Mirror For Photonic Integrated Circuits App 20140003766 - HECK; John ; et al.	2014-01-02
Hybrid III-V silicon laser formed by direct bonding Grant 08620164 -	2013-12-31
Hybrid III-V silicon laser formed by direct bonding Grant 8,620,164 - Heck , et al. December 31, 2	2013-12-31
Vertical Mirror In A Silicon Photonic Circuit App 20130299932 - HECK; JOHN ; et al.	2013-11-14
Integrated Silicon Optomechanical Gyroscopes (omgs) App 20130293898 - Heck; John ; et al.	2013-11-07
Semiconductor Substrate For An Optical Transmitter Apparatus And Method App 20130273672 - Heck; John ; et al.	2013-10-17
Apparatus, method and system for providing reflection of an optical signal Grant 8,530,818 - Heck , et al. September 10, 2	2013-09-10
Method for forming MEMS devices having low contact resistance and devices obtained thereof Grant 8,487,386 - Jain , et al. July 16, 2	2013-07-16
Microfluidic apparatus with integrated porous-substrate/sensor for real-time (BIO) chemical molecule detection Grant 8,465,698 - Yamakawa , et al. June 18, 2	2013-06-18
Vertical mirror in a silicon photonic circuit Grant 8,435,809 - Heck , et al. May 7, 2	2013-05-07
Seek Scan Probe (ssp) Cantilever To Mover Wafer Bond Stop App 20130058202 - Chou; Tsung-Kuan Allen ; et al.	2013-03-07
On-chip Diffraction Grating Prepared By Crystallographic Wet-etch App 20120250157 - Na; Yun-Chung ; et al.	2012-10-04
Hybrid Iii-v Silicon Laser Formed By Direct Bonding App 20120189317 - Heck; John ; et al.	2012-07-26
Method And Structure Combining Vertical And Angled Facets In Silicon Photonic Waveguides App 20120155820 - Heck; John ; et al.	2012-06-21
Microfluidic Apparatus With Integrated Porous-substrate/sensor For Real-time (bio) Chemical Molecule Detection App 20120141329 - YAMAKAWA; Mineo ; et al.	2012-06-07
Microfluidic apparatus with integrated porous-substrate/sensor for real-time (bio)chemical molecule detection Grant 8,153,079 - Yamakawa , et al. April 10, 2	2012-04-10
Optical Receiver Architecture Using A Mirrored Substrate App 20110315858 - Heck; John ; et al.	2011-12-29
Wafer-level In-P Si bonding for silicon photonic apparatus Grant 8,084,282 - Heck , et al. December 27, 2	2011-12-27
WAFER-LEVEL In-P Si BONDING FOR SILICON PHOTONIC APPARATUS App 20110244613 - Heck; John ; et al.	2011-10-06
Protection layers for media protection during fabrication of probe memory device Grant 8,018,821 - Heck September 13, 2	2011-09-13
Seek-scan Probe (ssp) Memory With Sharp Probe Tips Formed At Cmos-compatible Temperatures App 20110078835 - Heck; John	2011-03-31
Vertical Mirror In A Silicon Photonic Circuit App 20110073972 - Heck; John ; et al.	2011-03-31
Seek-scan probe (SSP) memory with sharp probe tips formed at CMOS-compatible temperatures Grant 7,869,334 - Heck January 11, 2	2011-01-11
Method for Forming MEMS Devices Having Low Contact Resistance and Devices Obtained Thereof App 20100320606 - Jain; Ajay ; et al.	2010-12-23
Microfluidic molecular-flow fractionator and bioreactor with integrated active/passive diffusion barrier App 20100322825 - Yamakawa; Mineo ; et al.	2010-12-23
Protection Layers For Media Protection During Fabrication Of Probe Memory Device App 20100127727 - Heck; John	2010-05-27
Forming a cantilever assembly for vertical and lateral movement Grant 7,687,297 - Heck , et al. March 30, 2	2010-03-30
Package With Integrated Magnets For Electromagnetically-actuated Probe-storage Device App 20100039729 - Heck; John ; et al.	2010-02-18
Inertial switch using fully released and enclosed conductive contact bridge Grant 7,633,025 - Smith , et al. December 15, 2	2009-12-15
Process For Fabricating High Density Storage Device With High-temperature Media App 20090294028 - Heck; John ; et al.	2009-12-03
Through-wafer vias and surface metallization for coupling thereto Grant 7,510,907 - Heck , et al. March 31, 2	2009-03-31
Transparent container Grant D584,945 - Friedland , et al. January 20, 2	2009-01-20
Forming a cantilever assembly for verticle and lateral movement App 20090001486 - Heck; John ; et al.	2009-01-01
Transparent container Grant D578,879 - Friedland , et al. October 21, 2	2008-10-21
Transparent container Grant D578,882 - Friedland , et al. October 21, 2	2008-10-21
Transparent container Grant D578,880 - Friedland , et al. October 21, 2	2008-10-21
Transparent container Grant D578,878 - Friedland , et al. October 21, 2	2008-10-21
Transparent container Grant D578,881 - Friedland , et al. October 21, 2	2008-10-21
Inertial switch using fully released and enclosed conductive contact bridge App 20080237003 - Smith; Joshua R. ; et al.	2008-10-02
Method Of Integrating Mems Structures And Cmos Structures Using Oxide Fusion Bonding App 20080233672 - Heck; John	2008-09-25
Seek-scan probe (SSP) memory with sharp probe tips formed at CMOS-compatible temperatures App 20080229577 - Heck; John	2008-09-25
MEMS packaging using a non-silicon substrate for encapsulation and interconnection Grant 7,368,808 - Heck , et al. May 6, 2	2008-05-06
Self sealed MEMS device App 20080090320 - Heck; John	2008-04-17
Microelectronic package having multiple conductive paths through an opening in a support substrate Grant 7,358,615 - Heck , et al. April 15, 2	2008-04-15
Ultra-low voltage capable zipper switch Grant 7,321,275 - Chou , et al. January 22, 2	2008-01-22
Electrically-isolated Interconnects And Seal Rings In Packages Using A Solder Preform App 20070241448 - Arana; Leonel R. ; et al.	2007-10-18
MEMS switch stopper bumps with adjustable height Grant 7,283,024 - Bar , et al. October 16, 2	2007-10-16
Self-packaging MEMS device App 20070235501 - Heck; John	2007-10-11
Container Grant D552,423 - Friedland , et al. October 9, 2	2007-10-09
Container Grant D551,908 - Friedland , et al. October 2, 2	2007-10-02
Container Grant D551,505 - Friedland , et al. September 25, 2	2007-09-25
Container Grant D551,508 - Friedland , et al. September 25, 2	2007-09-25
Container Grant D551,506 - Friedland , et al. September 25, 2	2007-09-25
Container Grant D551,507 - Friedland , et al. September 25, 2	2007-09-25
Electrically-isolated interconnects and seal rings in packages using a solder preform Grant 7,243,833 - Arana , et al. July 17, 2	2007-07-17
Transient liquid phase bonding method App 20070152026 - Suh; Daewoong ; et al.	2007-07-05
Microelectronic package having multiple conductive paths through an opening in a support substrate App 20070077747 - Heck; John ; et al.	2007-04-05
Module integrating MEMS and passive components Grant 7,183,622 - Heck , et al. February 27, 2	2007-02-27
Electrically-isolated interconnects and seal rings in packages using a solder preform App 20070000976 - Arana; Leonel R. ; et al.	2007-01-04
Through-wafer vias and surface metallization for coupling thereto App 20060289967 - Heck; John ; et al.	2006-12-28
Ultra-low voltage capable zipper switch App 20060290443 - Chou; Tsung-Kuan Allen ; et al.	2006-12-28
Low inductance via structures App 20060264029 - Heck; John ; et al.	2006-11-23
Reactive nano-layer material for MEMS packaging App 20060220223 - Lu; Daoqiang ; et al.	2006-10-05
MEMS packaging using a non-silicon substrate for encapsulation and interconnection App 20060194361 - Heck; John ; et al.	2006-08-31
Methods for sealing chambers of microelectronic packages App 20060192281 - Lu; Daoqiang ; et al.	2006-08-31
Manufacturing film bulk acoustic resonator filters App 20060176126 - Wang; Li-Peng ; et al.	2006-08-10
Microfabricated hot wire vacuum sensor Grant 7,087,451 - Arana , et al. August 8, 2	2006-08-08
Microelectronic package having chamber sealed by material including one or more intermetallic compounds Grant 7,061,099 - Lu , et al. June 13, 2	2006-06-13
Microelectronic Package Having Chamber Sealed By Material Including One Or More Intermetallic Compounds App 20060071324 - Lu; Daoqiang ; et al.	2006-04-06
Module integrating MEMS and passive components App 20060001123 - Heck; John ; et al.	2006-01-05
Microelectromechanical (MEMS) switching apparatus Grant 6,967,548 - Ma , et al. November 22, 2	2005-11-22
Temperature resistant hermetic sealing formed at low temperatures for MEMS packages App 20050253282 - Lu, Daoqiang ; et al.	2005-11-17
Composite beam microelectromechanical system switch App 20050248424 - Chou, Tsung-Kuan ; et al.	2005-11-10
Microfabricated hot wire vacuum sensor App 20050212066 - Arana, Leonel R. ; et al.	2005-09-29
Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator Grant 6,943,419 - Wong , et al. September 13, 2	2005-09-13
Microfluid molecular-flow fractionator and bioreactor with integrated active/passive diffusion barrier App 20050148064 - Yamakawa, Mineo ; et al.	2005-07-07
MEMS switch stopper bumps with adjustable height App 20050134413 - Bar, Hanan ; et al.	2005-06-23
Packaging microelectromechanical structures Grant 6,903,452 - Ma , et al. June 7, 2	2005-06-07
Packaging microelectromechanical structures App 20050062120 - Ma, Qing ; et al.	2005-03-24
Packaging microelectromechanical structures Grant 6,852,926 - Ma , et al. February 8, 2	2005-02-08
Microelectromechanical (MEMS) switching apparatus App 20050007219 - Ma, Qing ; et al.	2005-01-13
Microfluidic apparatus with integrated porous-substrate/sensor for real-time (bio)chemical molecule detection App 20040219072 - Yamakawa, Mineo ; et al.	2004-11-04
Microelectromechanical (MEMS) switching apparatus Grant 6,812,814 - Ma , et al. November 2, 2	2004-11-02
Microfluidic apparatus with integrated porous-substrate/sensor for real-time (bio)chemical molecule detection Grant 6,806,543 - Yamakawa , et al. October 19, 2	2004-10-19
Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator App 20040157367 - Wong, Daniel M. ; et al.	2004-08-12
Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator Grant 6,713,314 - Wong , et al. March 30, 2	2004-03-30
Microelectromechanical (MEMS) switching apparatus App 20040056740 - Ma, Qing ; et al.	2004-03-25
Microfluidic apparatus with integrated porous-substrate/sensor for real-time (bio)chemical molecule detection App 20040051154 - Yamakawa, Mineo ; et al.	2004-03-18
Packaging microelectromechanical structures App 20040051181 - Ma, Qing ; et al.	2004-03-18
Hermetically Packaging A Microelectromechanical Switch And A Film Bulk Acoustic Resonator App 20040032012 - Wong, Daniel M. ; et al.	2004-02-19
Manufacturing film bulk acoustic resonator filters App 20040027030 - Wang, Li-Peng ; et al.	2004-02-12
Microelectromechanical (MEMS) switching apparatus Grant 6,686,820 - Ma , et al. February 3, 2	2004-02-03
Microelectromechanical (mems) Switching Apparatus App 20040008097 - Ma, Qing ; et al.	2004-01-15
Packaging microelectromechanical structures Grant 6,673,697 - Ma , et al. January 6, 2	2004-01-06
Packaging Microelectromechanical Structures App 20030189242 - Ma, Qing ; et al.	2003-10-09
Packaging microelectromechanical systems App 20030183916 - Heck, John ; et al.	2003-10-02
Packaging microelectromechanical structures App 20030183407 - Ma, Qing ; et al.	2003-10-02