He; Yongyong

Patent Applications and Registrations

Patent applications and USPTO patent grants for He; Yongyong.The latest application filed is for "device for globally measuring thickness of metal film".

Company Profile

0.6.11

He; Yongyong - Beijing CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device for globally measuring thickness of metal film Grant 9,377,286 - Lu , et al. June 28, 2	2016-06-28
Method for measuring thickness of film on wafer edge Grant 9,255,780 - Lu , et al. February 9, 2	2016-02-09
Chemical mechanical polishing machine and chemical mechanical polishing apparatus comprising the same Grant 9,138,857 - Lu , et al. September 22, 2	2015-09-22
Device For Globally Measuring Thickness Of Metal Film App 20140062468 - Lu; Xinchun ; et al.	2014-03-06
Wafer Transfer Device For Chemical Mechanical Polishing Apparatus App 20130273819 - Lu; Xinchun ; et al.	2013-10-17
Method For Measuring Thickness Of Film On Wafer Edge App 20130211765 - Lu; Xinchun ; et al.	2013-08-15
Chemical Mechanical Polishing Machine And Chemical Mechanical Polishing Apparatus Comprising The Same App 20130130601 - Lu; Xinchun ; et al.	2013-05-23
Device and Method for Measuring Thickness of Slurry and Chemical Mechanical Polishing Apparatus Comprising the Device App 20130000845 - Lu; Xinchun ; et al.	2013-01-03
Device and Method for Measuring Physical Parameters of Slurry and Chemical Mechanical Polishing Apparatus Comprising the Device App 20120315826 - Lu; Xinchun ; et al.	2012-12-13
Pad Conditioner Head For Conditioning A Polishing Pad App 20120115403 - Lu; Xinchun ; et al.	2012-05-10

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