He; Ting Yu
Patent Applications and Registrations
Patent applications and USPTO patent grants for He; Ting Yu.The latest application filed is for "lead frame support plate and window clamp for wire bonding machines".
- He; Ting Yu - Singapore SG
| Patent | Date |
|---|---|
| Lead frame support plate and window clamp for wire bonding machines Grant 9,070,762 - Chuang , et al. June 30, 2 | 2015-06-30 |
| Lead Frame Support Plate And Window Clamp For Wire Bonding Machines App 20140217152 - CHUANG; Phui Phoong ; et al. | 2014-08-07 |
| Lead frame support plate and window clamp for wire bonding machines Grant 8,752,751 - Chuang , et al. June 17, 2 | 2014-06-17 |
| Bonding machine incorporating dual-track transfer mechanism Grant 8,707,550 - Song , et al. April 29, 2 | 2014-04-29 |
| Lead Frame Support Plate And Window Clamp For Wire Bonding Machines App 20140014708 - CHUANG; Phui Phoong ; et al. | 2014-01-16 |
| Bonding Machine Incorporating Dual-track Transfer Mechanism App 20110016707 - SONG; Keng Yew James ; et al. | 2011-01-27 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 