HE; Qingchun
Patent Applications and Registrations
Patent applications and USPTO patent grants for HE; Qingchun.The latest application filed is for "flow control method and apparatus, cu, du and storage medium".
- HE; Qingchun - Shenzhen CN
- He; Qingchun - Guangdong CN
- He; Qingchun - Beijing CN
- - Guangdong CN
- He; Qingchun - Tianjin CN
- He; Qingchun - Chengdu N/A CN
- He; Qingchun - Tainjin N/A CN
| Patent | Date |
|---|---|
| Flow Control Method And Apparatus, Cu, Du And Storage Medium App 20220070735 - GAO; Yin ; et al. | 2022-03-03 |
| Data packet synchronization Grant 11,206,106 - He , et al. December 21, 2 | 2021-12-21 |
| Flow control method and apparatus, CU, DU and storage medium Grant 11,153,783 - Gao , et al. October 19, 2 | 2021-10-19 |
| Communication Method And Apparatus App 20210314912 - He; Qingchun ; et al. | 2021-10-07 |
| Entity Configuration Method, Device And System, And Cu-u App 20210282221 - GAO; Yin ; et al. | 2021-09-09 |
| Entity configuration method, device and system, and CU-U Grant 11,019,680 - Gao , et al. May 25, 2 | 2021-05-25 |
| Data transmission method and device, and base station Grant 10,980,043 - He , et al. April 13, 2 | 2021-04-13 |
| Entity Configuration Method, Device And System, And Cu-u App 20200367315 - GAO; Yin ; et al. | 2020-11-19 |
| Data Packet Synchronization App 20200252164 - Kind Code | 2020-08-06 |
| Data packet synchronization Grant 10,560,226 - He , et al. Feb | 2020-02-11 |
| Method And Device For Determining Discontinuous Reception Configuration App 20200015312 - HE; Qingchun ; et al. | 2020-01-09 |
| Data packet synchronization Grant 10523370 - | 2019-12-31 |
| Control Signaling Configuration Method And Apparatus App 20190356450 - HE; Qingchun ; et al. | 2019-11-21 |
| Flow Control Method And Apparatus, Cu, Du And Storage Medium App 20190327644 - GAO; Yin ; et al. | 2019-10-24 |
| Data Packet Transmission Method And Device App 20190305892 - He; Qingchun ; et al. | 2019-10-03 |
| Data Transmission Method And Device, And Base Station App 20190274151 - HE; Qingchun ; et al. | 2019-09-05 |
| Packaged semiconductor devices having ribbon wires Grant 9,570,325 - Xu , et al. February 14, 2 | 2017-02-14 |
| Packaged Semiconductor Devices Having Ribbon Wires App 20160190086 - XU; LIQIANG ; et al. | 2016-06-30 |
| Semiconductor device and lead frame having vertical connection bars Grant 9,355,944 - Liu , et al. May 31, 2 | 2016-05-31 |
| Semiconductor Device And Lead Frame Having Vertical Connection Bars App 20160141230 - Liu; Peng ; et al. | 2016-05-19 |
| Device and process for continuously cleaning surface of molybdenum wire at high temperature Grant 9,328,425 - He , et al. May 3, 2 | 2016-05-03 |
| Packaged integrated circuit device having bent leads Grant 9,177,836 - Liu , et al. November 3, 2 | 2015-11-03 |
| Backside Metallization Patterns For Integrated Circuits App 20150235969 - Zhang; Hanmin ; et al. | 2015-08-20 |
| Semiconductor device and method of assembling same Grant 8,969,135 - Liu , et al. March 3, 2 | 2015-03-03 |
| Semiconductor Device And Method Of Assembling Same App 20140246767 - Liu; Peng ; et al. | 2014-09-04 |
| Wire Bonding Machine And Method For Testing Wire Bond Connections App 20140103096 - Zhang; Hanmin ; et al. | 2014-04-17 |
| Brace for long wire bond Grant 8,692,134 - Yang , et al. April 8, 2 | 2014-04-08 |
| Method of making chip-on-lead package Grant 8,642,395 - Li , et al. February 4, 2 | 2014-02-04 |
| Semiconductor package and lead frame therefor Grant 8,643,158 - Liu , et al. February 4, 2 | 2014-02-04 |
| Lead frame sheet Grant 8,486,540 - Li , et al. July 16, 2 | 2013-07-16 |
| Device and Process for Continuously Cleaning Surface of Molybdenum Wire at High Temperature App 20120291807 - He; Qingchun ; et al. | 2012-11-22 |
| Semiconductor Package And Lead Frame Therefor App 20120248590 - LIU; Peng ; et al. | 2012-10-04 |
| Semiconductor Device With Nested Rows Of Contacts App 20120112333 - Liu; Qiang ; et al. | 2012-05-10 |
| Semiconductor device with nested rows of contacts Grant 8,080,448 - Wu , et al. December 20, 2 | 2011-12-20 |
| Lead Frame With Recessed Die Bond Area App 20110241187 - Guo; Liping ; et al. | 2011-10-06 |
| Lead Frame Sheet App 20110212341 - Li; Ting ; et al. | 2011-09-01 |
| Lead Frame For Semiconductor Die App 20110193207 - Tian; Zhaojun ; et al. | 2011-08-11 |
| Method Of Packaging Semiconductor Device App 20110165729 - LIU; Peng ; et al. | 2011-07-07 |
| Lead Frame And Method Of Forming Same App 20110065240 - GAO; Xu ; et al. | 2011-03-17 |
| Method Of Making Chip-on-lead Package App 20100248426 - Li; Zhe ; et al. | 2010-09-30 |
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