| Patent | Date |
|---|
Chip-Process-Variation-Aware Power-Efficiency Optimization
App 20220300063 - He; Jiangqi ; et al. | 2022-09-22 |
Embedded thin-film magnetic inductor design for integrated voltage regulator (IVR) applications
Grant 11,373,966 - Kim , et al. June 28, 2 | 2022-06-28 |
Embedded Thin-film Magnetic Inductor Design For Integrated Voltage Regulator (ivr) Applications
App 20220189889 - Kim; Tae Hong ; et al. | 2022-06-16 |
Embedded Thin-film Magnetic Inductor Design For Integrated Voltage Regulator (ivr) Applications
App 20200402934 - Kim; Tae Hong ; et al. | 2020-12-24 |
Technologies for temperature measurement of a processor
Grant 10,318,396 - He , et al. | 2019-06-11 |
Technologies For Temperature Measurement Of A Processor
App 20170091061 - He; Jiangqi ; et al. | 2017-03-30 |
Shielding a connector to reduce interference
Grant 9,318,850 - Li , et al. April 19, 2 | 2016-04-19 |
Shielding A Connector To Reduce Interference
App 20150340817 - Li; Xiang ; et al. | 2015-11-26 |
Self referencing pin
Grant 8,465,297 - Zou , et al. June 18, 2 | 2013-06-18 |
Multi-chip assembly with optically coupled die
Grant 8,189,361 - Zhou , et al. May 29, 2 | 2012-05-29 |
Forming compliant contact pads for semiconductor packages
Grant 8,148,805 - Zhou , et al. April 3, 2 | 2012-04-03 |
Self Referencing Pin
App 20120077357 - Zou; Bin ; et al. | 2012-03-29 |
Substrate With Raised Edge Pads
App 20110239454 - Shi; Wei ; et al. | 2011-10-06 |
Integrated capacitors in package-level structures, processes of making same, and systems containing same
Grant 7,989,916 - Tang , et al. August 2, 2 | 2011-08-02 |
Forming Compliant Contact Pads for Semiconductor Packages
App 20110175230 - Zhou; Qing ; et al. | 2011-07-21 |
Substrate with raised edge pads
Grant 7,980,865 - Shi , et al. July 19, 2 | 2011-07-19 |
Forming compliant contact pads for semiconductor packages
Grant 7,939,922 - Zhou , et al. May 10, 2 | 2011-05-10 |
Multi-chip Assembly With Optically Coupled Die
App 20110058419 - Zhou; Qing A. ; et al. | 2011-03-10 |
Multi-chip assembly with optically coupled die
Grant 7,851,809 - Zhou , et al. December 14, 2 | 2010-12-14 |
Packaged spiral inductor structures, processes of making same, and systems containing same
Grant 7,852,189 - He , et al. December 14, 2 | 2010-12-14 |
Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same
Grant 7,723,164 - Lu , et al. May 25, 2 | 2010-05-25 |
Substrate with lossy material insert
Grant 7,714,430 - Zeng , et al. May 11, 2 | 2010-05-11 |
Package level noise isolation
Grant 7,709,934 - Zeng , et al. May 4, 2 | 2010-05-04 |
Integrated capacitors in package-level structures, processes of making same, and systems containing same
App 20100059858 - Tang; John J. ; et al. | 2010-03-11 |
Integrated capacitors in package-level structures, processes of making same, and systems containing same
Grant 7,670,919 - Tang , et al. March 2, 2 | 2010-03-02 |
Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same
Grant 7,659,143 - Tang , et al. February 9, 2 | 2010-02-09 |
Integrated circuit package with chip-side signal connections
Grant 7,611,924 - Kim , et al. November 3, 2 | 2009-11-03 |
I/O Architecture for integrated circuit package
Grant 7,589,414 - He , et al. September 15, 2 | 2009-09-15 |
Forming Compliant Contact Pads For Semiconductor Packages
App 20090200681 - Zhou; Qing ; et al. | 2009-08-13 |
Multi-chip assembly with optically coupled die
Grant 7,564,066 - Zhou , et al. July 21, 2 | 2009-07-21 |
Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture
Grant 7,554,203 - Zhou , et al. June 30, 2 | 2009-06-30 |
Forming compliant contact pads for semiconductor packages
Grant 7,538,019 - Zhou , et al. May 26, 2 | 2009-05-26 |
Reducing input capacitance of high speed integrated circuits
Grant 7,535,689 - Zeng , et al. May 19, 2 | 2009-05-19 |
Reducing parasitic mutual capacitances
Grant 7,535,080 - Zeng , et al. May 19, 2 | 2009-05-19 |
Dual die package with high-speed interconnect
Grant 7,511,359 - Tang , et al. March 31, 2 | 2009-03-31 |
Package Including a Microprocessor & Fourth Level Cache
App 20090039482 - He; Jiangqi ; et al. | 2009-02-12 |
Package level integration of antenna and RF front-end module
Grant 7,477,197 - Zeng , et al. January 13, 2 | 2009-01-13 |
Reducing input capacitance for high speed integrated circuits
App 20080316662 - Zeng; Xiang Yin ; et al. | 2008-12-25 |
Transmission line impedance matching
Grant 7,432,779 - Kim , et al. October 7, 2 | 2008-10-07 |
Integrated micro-channels for 3D through silicon architectures
Grant 7,432,592 - Shi , et al. October 7, 2 | 2008-10-07 |
Circuit board with trace configuration for high-speed digital differential signaling
Grant 7,417,872 - Li , et al. August 26, 2 | 2008-08-26 |
Package level noise isolation
App 20080157294 - Zeng; Xiang Yin ; et al. | 2008-07-03 |
Package Level Integration Of Antenna And Rf Front-end Module
App 20080158063 - ZENG; Xiang Yin ; et al. | 2008-07-03 |
Double side stacked die package
App 20080157322 - Tang; Jia Miao ; et al. | 2008-07-03 |
Increasing the resistance of a high frequency input/output power delivery decoupling path
App 20080145977 - Zeng; Xiang Yin ; et al. | 2008-06-19 |
Integrated Circuit Package With Chip-side Signal Connections
App 20080131997 - Kim; Joong-Ho ; et al. | 2008-06-05 |
Chip-to-chip optical interconnect
Grant 7,373,033 - Lu , et al. May 13, 2 | 2008-05-13 |
Substrate with lossy material insert
App 20080102565 - Zeng; Xiang Yin ; et al. | 2008-05-01 |
I/o Architecture For Integrated Circuit Package
App 20080088009 - He; Jiangqi ; et al. | 2008-04-17 |
Dual-chip Integrated Heat Spreader Assembly, Packages Containing Same, And Systems Containing Same
App 20080079144 - Tang; Jiamiao ; et al. | 2008-04-03 |
Vertical capacitor apparatus, systems, and methods
Grant 7,352,557 - Kim , et al. April 1, 2 | 2008-04-01 |
Array capacitor apparatuses to filter input/output signal
Grant 7,348,661 - Kim , et al. March 25, 2 | 2008-03-25 |
Integrated circuit package to provide high-bandwidth communication among multiple dice
Grant 7,348,678 - Zhou , et al. March 25, 2 | 2008-03-25 |
Integrated circuit package with chip-side signal connections
Grant 7,345,359 - Kim , et al. March 18, 2 | 2008-03-18 |
Dual Heat Spreader Panel Assembly Method For Bumpless Die-attach Packages, Packages Containing Same, And Systems Containing Same
App 20080054448 - Lu; Daoqiang ; et al. | 2008-03-06 |
Electronic Assembly With Stacked Ic's Using Two Or More Different Connection Technologies And Methods Of Manufacture
App 20080003717 - Zhou; Qing A. ; et al. | 2008-01-03 |
Chip-to-chip Optical Interconnect
App 20070297713 - Lu; Daoqiang ; et al. | 2007-12-27 |
Integrated Inductors And Compliant Interconnects For Semiconductor Packaging
App 20070290362 - Hsu; Rockwell ; et al. | 2007-12-20 |
Integrated inductors and compliant interconnects for semiconductor packaging
Grant 7,279,391 - Hsu , et al. October 9, 2 | 2007-10-09 |
Transmission line impedance matching
App 20070188262 - Kim; Hyunjun ; et al. | 2007-08-16 |
Data signal interconnection with reduced crosstalk
Grant 7,255,573 - He , et al. August 14, 2 | 2007-08-14 |
Integrated capacitors in package-level structures, processes of making same, and systems containing same
App 20070158818 - Tang; John J. ; et al. | 2007-07-12 |
Edge interconnects for die stacking
App 20070158807 - Lu; Daoqiang ; et al. | 2007-07-12 |
Fluxless heat spreader bonding with cold form solder
App 20070152321 - Shi; Wei ; et al. | 2007-07-05 |
Packaged spiral inductor structures, processes of making same, and systems containing same
App 20070152796 - He; Jiangqi ; et al. | 2007-07-05 |
Dual die package with high-speed interconnect
App 20070152312 - Tang; John J. ; et al. | 2007-07-05 |
Data Signal Interconnection With Reduced Crosstalk
App 20070155195 - He; Jiangqi ; et al. | 2007-07-05 |
Substrate with raised edge pads
App 20070155198 - Shi; Wei ; et al. | 2007-07-05 |
Plating bar design for high speed package design
App 20070145543 - Zeng; Xiang Yin ; et al. | 2007-06-28 |
Complementary inductor structures
App 20070146105 - Zeng; Xiang Yin ; et al. | 2007-06-28 |
Integrated circuit package to provide high-bandwidth communication among multiple dice
App 20070138647 - Zhou; Qing ; et al. | 2007-06-21 |
Forming compliant contact pads for semiconductor packages
App 20070132106 - Zhou; Qing ; et al. | 2007-06-14 |
IC package with signal land pads
Grant 7,227,247 - Zeng , et al. June 5, 2 | 2007-06-05 |
Transmission line impedance matching
Grant 7,218,183 - Kim , et al. May 15, 2 | 2007-05-15 |
Multi-chip assembly with optically coupled die
App 20070102733 - Zhou; Qing A. ; et al. | 2007-05-10 |
Multilayer inductor with shielding plane
Grant 7,209,025 - Kim , et al. April 24, 2 | 2007-04-24 |
Integrated micro-channels for 3D through silicon architectures
App 20070085198 - Shi; Wei ; et al. | 2007-04-19 |
Silicon building blocks in integrated circuit packaging
Grant 7,205,638 - Figueroa , et al. April 17, 2 | 2007-04-17 |
Low impedance inter-digital capacitor and method of using
Grant 7,173,803 - Zhong , et al. February 6, 2 | 2007-02-06 |
Reducing parasitic mutual capacitances
App 20070001260 - Zeng; Xiang Yin ; et al. | 2007-01-04 |
Circuit board with trace configuration for high-speed digital differential signaling
Grant 7,145,239 - Li , et al. December 5, 2 | 2006-12-05 |
Transmission line impedance matching
Grant 7,142,073 - Kim , et al. November 28, 2 | 2006-11-28 |
Circuit Board With Trace Configuration For High-speed Digital Differential Signaling
App 20060261465 - Li; Yuan-Liang ; et al. | 2006-11-23 |
Low parasitic inductance capacitor with central terminals
Grant 7,136,272 - Li , et al. November 14, 2 | 2006-11-14 |
Extended thin film capacitor (TFC)
Grant 7,123,466 - He , et al. October 17, 2 | 2006-10-17 |
Reference slots for signal traces
Grant 7,110,263 - He , et al. September 19, 2 | 2006-09-19 |
IC package with signal land pads
App 20060180905 - Zeng; Xiang Yin ; et al. | 2006-08-17 |
Methods of forming in package integrated capacitors and structures formed thereby
App 20060124985 - Zeng; Xiang Yin ; et al. | 2006-06-15 |
Methods of forming in package integrated capacitors and structures formed thereby
App 20060081998 - Zeng; Xiang Yin ; et al. | 2006-04-20 |
Extended thin film capacitor (TFC)
Grant 7,027,289 - He , et al. April 11, 2 | 2006-04-11 |
Array capacitor apparatuses to filter input/output signal
App 20060071341 - Kim; Hyunjun ; et al. | 2006-04-06 |
Integrated inductors and compliant interconnects for semiconductor packaging
App 20060038289 - Hsu; Rockwell ; et al. | 2006-02-23 |
Silicon building block architecture with flex tape
Grant 6,995,465 - Zhong , et al. February 7, 2 | 2006-02-07 |
Silicon building block architecture with flex tape
App 20060006507 - Zhong; Dong ; et al. | 2006-01-12 |
Package integrated one-quarter wavelength and three-quarter wavelength balun
App 20060001501 - He; Jiangqi ; et al. | 2006-01-05 |
Transmission line impedance matching
App 20050285695 - Kim, Hyunjun ; et al. | 2005-12-29 |
Extended thin film capacitor (TFC)
App 20050281008 - He, Jiangqi ; et al. | 2005-12-22 |
Low impedance, high-power socket and method of using
Grant 6,964,584 - Zhong , et al. November 15, 2 | 2005-11-15 |
Extended Thin Film Capacitor (tfc)
App 20050213281 - He, Jiangqi ; et al. | 2005-09-29 |
Reference slots for signal traces
App 20050201072 - He, Jiangqi ; et al. | 2005-09-15 |
Integrated circuit package with chip-side signal connections
App 20050194669 - Kim, Joong-Ho ; et al. | 2005-09-08 |
Vertical capacitor apparatus, systems, and methods
App 20050164465 - Kim, Hyunjun ; et al. | 2005-07-28 |
Circuit board with trace configuration for high-speed digital differential signaling
Grant 6,914,334 - Li , et al. July 5, 2 | 2005-07-05 |
Circuit board with trace configuration for high-speed digital differential signaling
App 20050139391 - Li, Yuan-Liang ; et al. | 2005-06-30 |
Multilayer inductor with shielding plane
App 20050128041 - Kim, Hyunjun ; et al. | 2005-06-16 |
Differential signal traces coupled with high permittivity material
App 20050087877 - Han, Dong-Ho ; et al. | 2005-04-28 |
Vertical capacitor apparatus, systems, and methods
Grant 6,885,544 - Kim , et al. April 26, 2 | 2005-04-26 |
Floating trace on signal layer
App 20050068751 - Kim, Hyunjun ; et al. | 2005-03-31 |
Vertical Capacitor Apparatus, Systems, And Methods
App 20050063137 - Kim, Hyunjun ; et al. | 2005-03-24 |
Silicon building blocks in integrated circuit packaging
App 20050029555 - Figueroa, David Gregory ; et al. | 2005-02-10 |
Silicon building block architecture with flex tape
App 20040245545 - Zhong, Dong ; et al. | 2004-12-09 |
Silicon building blocks in integrated circuit packaging
Grant 6,815,256 - Figueroa , et al. November 9, 2 | 2004-11-09 |
Low impedance inter-digital capacitor and method of using
App 20040209518 - Zhong, Dong ; et al. | 2004-10-21 |
Electronic assembly
Grant 6,803,649 - He , et al. October 12, 2 | 2004-10-12 |
Low parasitic inductance capacitor with central terminals
App 20040190218 - Li, Yuan-Liang ; et al. | 2004-09-30 |
Power/ground configuration for low impedance integrated circuit
Grant 6,784,532 - Zhong , et al. August 31, 2 | 2004-08-31 |
Silicon building blocks in integrated circuit packaging
App 20040119144 - Figueroa, David Gregory ; et al. | 2004-06-24 |
Low impedance inter-digital capacitor and method of using
Grant 6,731,493 - Zhong , et al. May 4, 2 | 2004-05-04 |
Via configuration for differential signaling through power or ground planes
App 20040039859 - He, Jiangqi ; et al. | 2004-02-26 |
Power/ground configuration for low impedance integrated circuit
App 20040021215 - Zhong, Dong ; et al. | 2004-02-05 |
Circuit board with trace configuration for high-speed digital differential signaling
App 20030230807 - Li, Yuan-Liang ; et al. | 2003-12-18 |
Low impedance inter-digital capacitor and method of using
App 20030184951 - Zhong, Dong ; et al. | 2003-10-02 |
Low impedance, high-power socket and method of using
App 20030119341 - Zhong, Dong ; et al. | 2003-06-26 |
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