He; Dongming

Patent Applications and Registrations

Patent applications and USPTO patent grants for He; Dongming.The latest application filed is for "sidewall wetting barrier for conductive pillars".

Company Profile

1.12.17

He; Dongming - San Diego CA
He; Dongming - Ningde CN
HE; Dongming - Dongguan City CN
He; Dongming - Gilbert AZ
He; Dongming - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods Grant 11,437,335 - Kang , et al. September 6, 2	2022-09-06
Sidewall Wetting Barrier For Conductive Pillars App 20220270995 - HU; Wei ; et al.	2022-08-25
Flip-chip device Grant 11,417,622 - Sun , et al. August 16, 2	2022-08-16
Integrated Circuit (ic) Packages Employing A Thermal Conductive Package Substrate With Die Region Split, And Related Fabrication Methods App 20210242160 - Kang; Kuiwon ; et al.	2021-08-05
Thermal Compression Flip Chip Bump App 20210210449 - HE; Dongming ; et al.	2021-07-08
Flip-chip Device App 20210118834 - SUN; Yangyang ; et al.	2021-04-22
Integrated Device Comprising Bump On Exposed Redistribution Interconnect App 20180331061 - He; Dongming ; et al.	2018-11-15
Separator and electrochemical device Grant 9,607,777 - Cheng , et al. March 28, 2	2017-03-28
Stacked multi-chip integrated circuit package Grant 9,406,649 - He , et al. August 2, 2	2016-08-02
Lithium-ion Secondary Battery And Preparation Method Thereof App 20160190591 - SHEN; Hongguang ; et al.	2016-06-30
Stacked Multi-chip Integrated Circuit Package App 20150155265 - He; Dongming ; et al.	2015-06-04
Stacked multi-chip integrated circuit package Grant 8,963,339 - He , et al. February 24, 2	2015-02-24
Separator And Electrochemical Device App 20150004498 - Cheng; Sheng ; et al.	2015-01-01
Stacked Multi-chip Integrated Circuit Package App 20140097535 - He; Dongming ; et al.	2014-04-10
C4 joint reliability Grant 7,656,035 - Agraharam , et al. February 2, 2	2010-02-02
Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same Grant 7,626,251 - Lu , et al. December 1, 2	2009-12-01
C4 Joint Reliability App 20090115057 - Agraharam; Sairam ; et al.	2009-05-07
C4 joint reliability Grant 7,517,787 - Agraharam , et al. April 14, 2	2009-04-14
Packaged Integrated Circuit And Method Of Forming Thereof App 20090065931 - Rangaraj; Sudarshan V. ; et al.	2009-03-12
Integrated circuit packages with reduced stress on die and associated methods Grant 7,465,651 - Agraharam , et al. December 16, 2	2008-12-16
Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same App 20080079125 - Lu; Daoqiang ; et al.	2008-04-03
Embedded on-die laser source and optical interconnect Grant 7,251,389 - Lu , et al. July 31, 2	2007-07-31
Embedded on-die laser source and optical interconnect App 20070081760 - Lu; Daoqiang ; et al.	2007-04-12
C4 joint reliability App 20060214292 - Agraharam; Sairam ; et al.	2006-09-28
Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems Grant 6,989,586 - Agraharam , et al. January 24, 2	2006-01-24
Integrated circuit packages with reduced stress on die and associated methods App 20050266613 - Agraharam, Sairam ; et al.	2005-12-01
Integrated circuit package with reduced stress on die and associated methods App 20040188813 - Agraharam, Sairam ; et al.	2004-09-30
Integrated thin film liquid conductivity sensor Grant 6,573,734 - He , et al. June 3, 2	2003-06-03
Integrated thin film liquid conductivity sensor App 20020167322 - He, Dongming ; et al.	2002-11-14

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