He Bei Sinopack Electronic Tech Co., Ltd.
Patent Applications and Registrations
Patent applications and USPTO patent grants for He Bei Sinopack Electronic Tech Co., Ltd..The latest application filed is for "package structure for semiconductor device, and semiconductor device".
- He Bei Sinopack Electronic Tech Co., Ltd. - Shijiazhuang CN
- HE BEI SINOPACK ELECTRONIC TECH CO., LTD. - Shijiazhuang City CN
- HE BEI SINOPACK ELECTRONIC TECH CO., LTD. - Shijiazhuang, Hebei Province N/A CN
| Patent | Date |
|---|---|
| Package structure for semiconductor device, and semiconductor device Grant 11,309,439 - Liu , et al. April 19, 2 | 2022-04-19 |
| Package Structure for Semiconductor Device, and Semiconductor Device App 20210111285 - Liu; Yao ; et al. | 2021-04-15 |
| Method for fabricating ceramic insulator for electronic packaging Grant 9,999,125 - Zhao , et al. June 12, 2 | 2018-06-12 |
| Method For Fabricating Ceramic Insulator For Electronic Packaging App 20170257946 - Zhao; Dongliang ; et al. | 2017-09-07 |
| Ceramic insulator for electronic packaging and method for fabricating the same Grant 9,713,252 - Ding , et al. July 18, 2 | 2017-07-18 |
| Ceramic Insulator For Electronic Packaging And Method For Fabricating The Same App 20170135204 - Ding; Fei ; et al. | 2017-05-11 |
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