| Patent | Date |
|---|
Semiconductor device packaging warpage control
Grant 11,404,288 - Vincent , et al. August 2, 2 | 2022-08-02 |
Semiconductor Device Package Having Thermal Dissipation Feature And Method Therefor
App 20220181230 - Vincent; Michael B. ; et al. | 2022-06-09 |
Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide
Grant 11,335,652 - Vincent , et al. May 17, 2 | 2022-05-17 |
Semiconductor Device Package Having Stress Isolation And Method Therefor
App 20220068738 - Vincent; Michael B. ; et al. | 2022-03-03 |
Semiconductor Device Having A Translation Feature And Method Therefor
App 20220068828 - Vincent; Michael B. ; et al. | 2022-03-03 |
Semiconductor Device With Waveguide And Method Therefor
App 20210391285 - Vincent; Michael B. ; et al. | 2021-12-16 |
Semiconductor device with waveguide and method therefor
Grant 11,133,273 - Vincent , et al. September 28, 2 | 2021-09-28 |
No-gel Pressure Sensor Package
App 20210221671 - Hooper; Stephen Ryan ; et al. | 2021-07-22 |
Semiconductor Device With Waveguide And Method Therefor
App 20210183796 - VINCENT; MICHAEL B. ; et al. | 2021-06-17 |
Package integrated waveguide
Grant 11,031,681 - Vincent , et al. June 8, 2 | 2021-06-08 |
Method, System, and Apparatus for Forming Three-Dimensional Semiconductor Device Package with Waveguide
App 20210035927 - Vincent; Michael B. ; et al. | 2021-02-04 |
Package Integrated Waveguide
App 20200403298 - Vincent; Michael B. ; et al. | 2020-12-24 |
Plated opening with vent path
Grant 10,834,817 - Vincent , et al. November 10, 2 | 2020-11-10 |
Package integrated waveguide
Grant 10,651,541 - Hayes , et al. | 2020-05-12 |
Microelectronic devices with multi-layer package surface conductors and methods of their fabrication
Grant 10,388,607 - Gong , et al. A | 2019-08-20 |
Plated Opening With Vent Path
App 20190059157 - Vincent; Michael B. ; et al. | 2019-02-21 |
High power semiconductor package subsystems
Grant 10,211,177 - Viswanathan , et al. Feb | 2019-02-19 |
Packaged devices with multiple planes of embedded electronic devices
Grant 10,163,874 - Vincent , et al. Dec | 2018-12-25 |
Plated opening with vent path
Grant 10,143,084 - Vincent , et al. Nov | 2018-11-27 |
EMI/RFI shielding for semiconductor device packages
Grant 10,074,614 - Gong , et al. September 11, 2 | 2018-09-11 |
Plated Opening With Vent Path
App 20180177049 - Vincent; Michael B. ; et al. | 2018-06-21 |
Optically-masked microelectronic packages and methods for the fabrication thereof
Grant 9,997,492 - Yap , et al. June 12, 2 | 2018-06-12 |
Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication
Grant 9,960,149 - Vincent , et al. May 1, 2 | 2018-05-01 |
Packaged Devices With Multiple Planes Of Embedded Electronic Devices
App 20180006001 - VINCENT; MICHAEL B. ; et al. | 2018-01-04 |
Packaged devices with multiple planes of embedded electronic devices
Grant 9,799,636 - Vincent , et al. October 24, 2 | 2017-10-24 |
High Power Semiconductor Package Subsystems
App 20170271292 - Viswanathan; Lakshminarayan ; et al. | 2017-09-21 |
Emi/rfi Shielding For Semiconductor Device Packages
App 20170263572 - Gong; Zhiwei ; et al. | 2017-09-14 |
Microelectronic packages having embedded sidewall substrates and methods for the producing thereof
Grant 9,761,565 - Vincent , et al. September 12, 2 | 2017-09-12 |
EMI/RFI shielding for semiconductor device packages
Grant 9,673,150 - Gong , et al. June 6, 2 | 2017-06-06 |
High power semiconductor package subsystems
Grant 9,673,162 - Viswanathan , et al. June 6, 2 | 2017-06-06 |
Packaged Devices With Multiple Planes Of Embedded Electronic Devices
App 20170141087 - VINCENT; MICHAEL B. ; et al. | 2017-05-18 |
Microelectronic Packages Having Embedded Sidewall Substrates And Methods For The Producing Thereof
App 20170141084 - VINCENT; MICHAEL B. ; et al. | 2017-05-18 |
Microelectronic packages having embedded sidewall substrates and methods for the producing thereof
Grant 9,595,485 - Vincent , et al. March 14, 2 | 2017-03-14 |
Three-dimensional Integrated Circuit Systems In A Package And Methods Therefor
App 20170053862 - GONG; ZHIWEI ; et al. | 2017-02-23 |
Three-dimensional integrated circuit systems in a package and methods therefor
Grant 9,570,387 - Gong , et al. February 14, 2 | 2017-02-14 |
Solder pad for semiconductor device package
Grant 9,548,280 - Sarihan , et al. January 17, 2 | 2017-01-17 |
Microelectronic packages having trench vias and methods for the manufacture thereof
Grant 9,520,323 - Vincent , et al. December 13, 2 | 2016-12-13 |
Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers
Grant 9,502,363 - Vincent , et al. November 22, 2 | 2016-11-22 |
Microelectronic Devices With Multi-layer Package Surface Conductors And Methods Of Their Fabrication
App 20160181202 - GONG; ZHIWEI ; et al. | 2016-06-23 |
Emi/rfi Shielding For Semiconductor Device Packages
App 20160172309 - Gong; Zhiwei ; et al. | 2016-06-16 |
Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereof
Grant 9,355,985 - Vincent , et al. May 31, 2 | 2016-05-31 |
Devices And Stacked Microelectronic Packages With Package Surface Conductors And Methods Of Their Fabrication
App 20160133608 - Vincent; Michael B. ; et al. | 2016-05-12 |
Semiconductor package with thermal via and method for fabrication thereof
Grant 9,312,206 - Yap , et al. April 12, 2 | 2016-04-12 |
Microelectronic packages having layered interconnect structures and methods for the manufacture thereof
Grant 9,281,293 - Magnus , et al. March 8, 2 | 2016-03-08 |
Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication
Grant 9,263,420 - Vincent , et al. February 16, 2 | 2016-02-16 |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
Grant 9,257,415 - Vincent , et al. February 9, 2 | 2016-02-09 |
Microelectronic Packages Having Embedded Sidewall Substrates And Methods For The Producing Thereof
App 20150380386 - VINCENT; MICHAEL B. ; et al. | 2015-12-31 |
Microelectronic Packages Having Sidewall-deposited Heat Spreader Structures And Methods For The Fabrication Thereof
App 20150348865 - VINCENT; MICHAEL B. ; et al. | 2015-12-03 |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
Grant 9,190,390 - Gong , et al. November 17, 2 | 2015-11-17 |
Solder Pad for Semiconductor Device Package
App 20150287685 - Sarihan; Vijay ; et al. | 2015-10-08 |
Wafer Level Packages And Methods For Producing Wafer Level Packages Having Delamination-resistant Redistribution Layers
App 20150270233 - VINCENT; MICHAEL B. ; et al. | 2015-09-24 |
Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits
Grant 9,142,502 - Gong , et al. September 22, 2 | 2015-09-22 |
Method for singulating electronic components from a substrate
Grant 9,142,434 - Gao , et al. September 22, 2 | 2015-09-22 |
Semiconductor Package With Thermal Via And Method For Fabrication Thereof
App 20150255371 - Yap; Weng F. ; et al. | 2015-09-10 |
Stacked Microelectronic Packages Having Sidewall Conductors And Methods For The Fabrication Thereof
App 20150243635 - VINCENT; MICHAEL B. ; et al. | 2015-08-27 |
Warp compensated electronic assemblies
Grant 9,107,303 - Lytle , et al. August 11, 2 | 2015-08-11 |
Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereof
Grant 9,093,457 - Gong , et al. July 28, 2 | 2015-07-28 |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
Grant 9,064,977 - June 23, 2 | 2015-06-23 |
Devices And Stacked Microelectronic Packages With Package Surface Conductors And Methods Of Their Fabrication
App 20150162309 - VINCENT; MICHAEL B. ; et al. | 2015-06-11 |
Optically-masked Microelectronic Packages And Methods For The Fabrication Thereof
App 20150137381 - YAP; WENG F. ; et al. | 2015-05-21 |
Apparatus and methods for quad flat no lead packaging
Grant 9,034,697 - Gong , et al. May 19, 2 | 2015-05-19 |
Microelectronic Packages Having Layered Interconnect Structures And Methods For The Manufacture Thereof
App 20150115454 - Magnus; Alan J. ; et al. | 2015-04-30 |
Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
Grant 8,916,421 - Gong , et al. December 23, 2 | 2014-12-23 |
Warp Compensated Electronic Assemblies
App 20140369015 - LYTLE; WILLIAM H. ; et al. | 2014-12-18 |
Warp compensated package and method
Grant 8,829,661 - Lytle , et al. September 9, 2 | 2014-09-09 |
Microelectronic Packages Having Trench Vias And Methods For The Manufacture Thereof
App 20140070415 - Vincent; Michael B. ; et al. | 2014-03-13 |
High Power Semiconductor Package Subsystems
App 20140070397 - Viswanathan; Lakshminarayan ; et al. | 2014-03-13 |
Stacked Microelectronic Packages Having Sidewall Conductors And Methods For The Fabrication Thereof
App 20140054797 - Gong (Tony); Zhiwei ; et al. | 2014-02-27 |
Stacked Microelectronic Packages Having Sidewall Conductors And Methods For The Fabrication Thereof
App 20140054783 - GONG (Tony); ZHIWEI ; et al. | 2014-02-27 |
Stacked Microelectronic Packages Having Patterened Sidewall Conductors And Methods For The Fabrication Thereof
App 20140054796 - Gong; Zhiwei (Tony) ; et al. | 2014-02-27 |
Sensor Packages And Method Of Packaging Dies Of Various Sizes
App 20140048946 - Bowles; Philip H. ; et al. | 2014-02-20 |
Back side alignment structure and manufacturing method for three-dimensional semiconductor device packages
Grant 8,617,935 - Xu , et al. December 31, 2 | 2013-12-31 |
Semiconductor device packaging having substrate with pre-encapsulation through via formation
Grant 8,597,983 - Gong , et al. December 3, 2 | 2013-12-03 |
Method for packaging an electronic device assembly having a capped device interconnect
Grant 8,592,241 - Hayes , et al. November 26, 2 | 2013-11-26 |
Semiconductor Device Packaging Using Encapsulated Conductive Balls For Package-on-package Back Side Coupling
App 20130154091 - Wright; Jason R. ; et al. | 2013-06-20 |
Semiconductor Device Packaging Having Substrate With Pre-encapsulation Through Via Formation
App 20130127030 - Gong; Zhiwei ; et al. | 2013-05-23 |
Capped Device Interconnect In A Semiconductor Package
App 20130078753 - Hayes; Scott M. ; et al. | 2013-03-28 |
Back Side Alignment Structure And Manufacturing Method For Three-dimensional Semiconductor Device Packages
App 20130052777 - Xu; Jianwen ; et al. | 2013-02-28 |
Semiconductor Device Packaging Having Pre-encapsulation Through Via Formation
App 20130049218 - Gong; Zhiwei ; et al. | 2013-02-28 |
Semiconductor Device Packaging Having Pre-encapsulation Through Via Formation Using Lead Frames With Attached Signal Conduits
App 20130049182 - Gong; Zhiwei ; et al. | 2013-02-28 |
Semiconductor Device Packaging Having Pre-encapsulation Through Via Formation Using Drop-in Signal Conduits
App 20130049217 - Gong; Zhiwei ; et al. | 2013-02-28 |
Semiconductor device with a controlled cavity and method of formation
Grant 8,378,433 - Hayes , et al. February 19, 2 | 2013-02-19 |
Apparatus And Methods For Quad Flat No Lead Packaging
App 20130015566 - GONG; ZHIWEI ; et al. | 2013-01-17 |
Method for releasing a microelectronic assembly from a carrier substrate
Grant 8,327,532 - Xu , et al. December 11, 2 | 2012-12-11 |
Method of forming a packaged semiconductor device
Grant 8,216,918 - Gong , et al. July 10, 2 | 2012-07-10 |
Method Of Forming A Packaged Semiconductor Device
App 20120021565 - Gong; Zhiwei ; et al. | 2012-01-26 |
Semiconductor Device With A Controlled Cavity And Method Of Formation
App 20110241181 - HAYES; SCOTT M. ; et al. | 2011-10-06 |
Method For Singulating Electronic Components From A Substrate
App 20110217814 - Gao; Wei ; et al. | 2011-09-08 |
Semiconductor device with a controlled cavity and method of formation
Grant 7,985,659 - Hayes , et al. July 26, 2 | 2011-07-26 |
Integrated conformal shielding method and process using redistributed chip packaging
Grant 7,981,730 - Tang , et al. July 19, 2 | 2011-07-19 |
Method and apparatus for mini module EMI shielding evaluation
Grant 7,969,164 - Tang , et al. June 28, 2 | 2011-06-28 |
Method And System For Releasing A Microelectronic Assembly From A Carrier Substrate
App 20110119910 - Xu; Jianwen ; et al. | 2011-05-26 |
Method Of Packaging Integrated Circuit Dies With Thermal Dissipation Capability
App 20100148357 - Yang; Liyu ; et al. | 2010-06-17 |
Integrated Conformal Shielding Method and Process Using Redistributed Chip Packaging
App 20100006988 - Tang; Jinbang ; et al. | 2010-01-14 |
Method And Apparatus For Mini Module Emi Shielding Evaluation
App 20090243629 - Tang; Jinbang ; et al. | 2009-10-01 |
Warp compensated package and method
App 20070210427 - Lytle; William H. ; et al. | 2007-09-13 |
Radiation shielded module and method of shielding microelectronic device
Grant 7,145,084 - Sarihan , et al. December 5, 2 | 2006-12-05 |
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