loadpatents
name:-0.018619060516357
name:-0.027501106262207
name:-0.0015370845794678
Hayashida; Akira Patent Filings

Hayashida; Akira

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hayashida; Akira.The latest application filed is for "information processing device and information processing method".

Company Profile
0.28.13
  • Hayashida; Akira - Kawasaki JP
  • Hayashida; Akira - Toyama N/A JP
  • Hayashida; Akira - Toyama-shi JP
  • Hayashida; Akira - Toyamashi JP
  • Hayashida; Akira - Tokyo JP
  • Hayashida; Akira - Higashimurayama JP
  • Hayashida; Akira - Joetsu JP
  • Hayashida; Akira - Niigata JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Information processing device and information processing method
Grant 10,789,141 - Hayashida September 29, 2
2020-09-29
Information Processing Device And Information Processing Method
App 20190073285 - Hayashida; Akira
2019-03-07
Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and insulator
Grant 9,184,069 - Hayashida , et al. November 10, 2
2015-11-10
Information processing apparatus with secure boot capability capable of verification of configuration change
Grant 8,838,952 - Hayashida September 16, 2
2014-09-16
Heat treatment apparatus and method of manufacturing semiconductor device
Grant 8,734,148 - Yamazaki , et al. May 27, 2
2014-05-27
Substrate processing method and film forming method
Grant 8,507,296 - Ueno , et al. August 13, 2
2013-08-13
Substrate processing apparatus and substrate processing method
Grant 8,501,599 - Ueno , et al. August 6, 2
2013-08-06
Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and extending member
Grant 8,158,911 - Hayashida , et al. April 17, 2
2012-04-17
Substrate processing apparatus, coolant gas supply nozzle and semiconductor device manufacturing method
Grant 8,148,271 - Ueno , et al. April 3, 2
2012-04-03
Heating apparatus, substrate processing apparatus, and method of manufacturing semiconductor devices
Grant 8,116,618 - Hayashida , et al. February 14, 2
2012-02-14
Information Processing Apparatus Having Verification Capability Of Configuration Change
App 20120011353 - Hayashida; Akira
2012-01-12
Heat Treatment Apparatus And Method Of Manufacturing Semiconductor Device
App 20110207339 - YAMAZAKI; Keishin ;   et al.
2011-08-25
Substrate processing apparatus, heating apparatus for use in the same, method of manufacturing semiconductors with those apparatuses, and heating element supporting structure
Grant 7,863,204 - Miyata , et al. January 4, 2
2011-01-04
Substrate processing method and semiconductor manufacturing apparatus
Grant 7,727,780 - Sugishita , et al. June 1, 2
2010-06-01
Substrate processing apparatus having gas side flow via gas inlet
Grant 7,700,054 - Hayashida , et al. April 20, 2
2010-04-20
Substrate Processing Apparatus, Coolant Gas Supply Nozzle and Semiconductor Device Manufacturing Method
App 20090291566 - Ueno; Masaaki ;   et al.
2009-11-26
Substrate processing method and film forming method
App 20090197352 - Ueno; Masaaki ;   et al.
2009-08-06
Semiconductor Manufacturing Apparatus And Substrate Processing Method
App 20090095422 - SUGISHITA; Masashi ;   et al.
2009-04-16
Substrate processing apparatus, heating apparatus for use in the same, method of manufacturing semiconductors with those apparatuses, and heating element supporting structure
App 20090035948 - Miyata; Toshimitsu ;   et al.
2009-02-05
Substrate Processing Apparatus and Substrate Processing Method
App 20090029486 - Ueno; Masaaki ;   et al.
2009-01-29
Heating apparatus, substrate processing apparatus, and method of manufacturing semiconductor devices
App 20090016706 - Hayashida; Akira ;   et al.
2009-01-15
Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and extending member
App 20090014428 - Hayashida; Akira ;   et al.
2009-01-15
Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and insulator
App 20090014435 - Hayashida; Akira ;   et al.
2009-01-15
Substrate processing method and semiconductor manufacturing apparatus
App 20080182345 - Sugishita; Masashi ;   et al.
2008-07-31
Substrate processing apparatus, method of manufacturing semiconductor device, and heating apparatus
App 20080153314 - Hayashida; Akira ;   et al.
2008-06-26
Polycarbodiimide resin-containing adhesive and flexible printed circuit board
Grant 5,916,675 - Komoto , et al. June 29, 1
1999-06-29
Method for preparing crosslinked polycarbodiimides
Grant 5,837,801 - Yahata , et al. November 17, 1
1998-11-17
Polycarbodiimide derivative and process for producing the same
Grant 5,770,661 - Miyoshi , et al. June 23, 1
1998-06-23
Method for preparing organic silazane polymers and method for preparing ceramics from the polymers
Grant 5,200,371 - Takeda , et al. April 6, 1
1993-04-06
Methods for preparing polytitanocarbosilazane polymers and ceramics therefrom
Grant 5,041,515 - Takeda , et al. August 20, 1
1991-08-20
Preparation of hollow ceramic fibers
Grant 4,948,763 - Hayashida , et al. August 14, 1
1990-08-14
Process for producing silicon carbide whiskers
Grant 4,849,196 - Yamada , et al. July 18, 1
1989-07-18
Method for the preparation of a sintered body of silicon carbide
Grant 4,762,810 - Endo , et al. August 9, 1
1988-08-09
Precursor composition of silicon carbide
Grant 4,657,991 - Takamizawa , et al. April 14, 1
1987-04-14
Ultrafine powder of silicon carbide, a method for the preparation thereof and a sintered body therefrom
Grant 4,571,331 - Endou , et al. February 18, 1
1986-02-18
Organoborosilicon polymer and a method for the preparation thereof
Grant 4,550,151 - Takamizawa , et al. October 29, 1
1985-10-29

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