loadpatents
Patent applications and USPTO patent grants for HAYASHI; Shinjiro.The latest application filed is for "toner".
Patent | Date |
---|---|
Toner App 20220171304 - HAYASHI; Shinjiro ;   et al. | 2022-06-02 |
Catalyst solution for electroless plating Grant 10,543,482 - Okada , et al. Ja | 2020-01-28 |
Copper electroplating solution and method of copper electroplating Grant 9,637,833 - Saito , et al. May 2, 2 | 2017-05-02 |
Electrolytic Copper Plating Solution App 20160186348 - Mizuno; Yoko ;   et al. | 2016-06-30 |
Copper electroplating solution and method of copper electroplating Grant 9,175,413 - Saito , et al. November 3, 2 | 2015-11-03 |
Electrolytic copper plating solution and method of electrolytic copper plating Grant 9,169,576 - Saito , et al. October 27, 2 | 2015-10-27 |
Electrolytic copper plating liquid and the electrolytic copper plating method Grant 9,150,976 - Saito , et al. October 6, 2 | 2015-10-06 |
Catalyst Solution For Electroless Plating App 20150118406 - OKADA; Hiroki ;   et al. | 2015-04-30 |
Copper Electroplating Solution And Method Of Copper Electroplating App 20140183052 - SAITO; Mutsuko ;   et al. | 2014-07-03 |
Copper Electroplating Solution And Method Of Copper Electroplating App 20140174937 - Saito; Matsuko ;   et al. | 2014-06-26 |
Electrolytic Copper Plating Liquid And The Electrolytic Copper Plating Method App 20140097087 - SAITO; Mutsuko ;   et al. | 2014-04-10 |
Electrolytic Copper Plating Solution And Method Of Electrolytic Copper Plating App 20130319867 - SAITO; Mutsuko ;   et al. | 2013-12-05 |
Tin Plating Solution App 20120132530 - HAYASHI; Shinjiro ;   et al. | 2012-05-31 |
Copper plating process Grant 7,857,960 - Hayashi , et al. December 28, 2 | 2010-12-28 |
Copper plating bath formulation Grant 7,857,961 - Hayashi , et al. December 28, 2 | 2010-12-28 |
Copper plating bath formulation App 20090038951 - Hayashi; Shinjiro ;   et al. | 2009-02-12 |
Copper plating process App 20090038949 - Hayashi; Shinjiro ;   et al. | 2009-02-12 |
Plating method Grant 7,374,652 - Hayashi , et al. May 20, 2 | 2008-05-20 |
Plating method App 20070007143 - Hayashi; Shinjiro ;   et al. | 2007-01-11 |
Method for electrolytic copper plating Grant 6,977,035 - Tsuchida , et al. December 20, 2 | 2005-12-20 |
Electrolytic copper plating solution and method for controlling the same Grant 6,881,319 - Seita , et al. April 19, 2 | 2005-04-19 |
Electrolytic copper plating method Grant 6,835,294 - Tsuchida , et al. December 28, 2 | 2004-12-28 |
Method for electrolytic copper plating App 20040217008 - Tsuchida, Hideki ;   et al. | 2004-11-04 |
Process for electrolytic copper plating App 20040089557 - Tsuchida, Hideki ;   et al. | 2004-05-13 |
Electrolytic copper plating solution and method for controlling the same App 20030094376 - Seita, Masaru ;   et al. | 2003-05-22 |
Electrolytic copper plating method App 20030015433 - Tsuchida, Hideki ;   et al. | 2003-01-23 |
Vibration damping device for a mechanical clutch release system Grant 4,266,439 - Hayashi , et al. May 12, 1 | 1981-05-12 |
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