loadpatents
name:-0.023313999176025
name:-0.020677804946899
name:-0.0031721591949463
HAYASHI; Shinjiro Patent Filings

HAYASHI; Shinjiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for HAYASHI; Shinjiro.The latest application filed is for "toner".

Company Profile
0.12.15
  • HAYASHI; Shinjiro - Sakai City JP
  • Hayashi; Shinjiro - Niigata JP
  • Hayashi; Shinjiro - Niigata-shi JP
  • Hayashi; Shinjiro - Saitama JP
  • Hayashi; Shinjiro - Saitama-City JP
  • Hayashi; Shinjiro - Omiya-ku JP
  • Hayashi, Shinjiro - Saitama-shi JP
  • Hayashi; Shinjiro - Toyota JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Toner
App 20220171304 - HAYASHI; Shinjiro ;   et al.
2022-06-02
Catalyst solution for electroless plating
Grant 10,543,482 - Okada , et al. Ja
2020-01-28
Copper electroplating solution and method of copper electroplating
Grant 9,637,833 - Saito , et al. May 2, 2
2017-05-02
Electrolytic Copper Plating Solution
App 20160186348 - Mizuno; Yoko ;   et al.
2016-06-30
Copper electroplating solution and method of copper electroplating
Grant 9,175,413 - Saito , et al. November 3, 2
2015-11-03
Electrolytic copper plating solution and method of electrolytic copper plating
Grant 9,169,576 - Saito , et al. October 27, 2
2015-10-27
Electrolytic copper plating liquid and the electrolytic copper plating method
Grant 9,150,976 - Saito , et al. October 6, 2
2015-10-06
Catalyst Solution For Electroless Plating
App 20150118406 - OKADA; Hiroki ;   et al.
2015-04-30
Copper Electroplating Solution And Method Of Copper Electroplating
App 20140183052 - SAITO; Mutsuko ;   et al.
2014-07-03
Copper Electroplating Solution And Method Of Copper Electroplating
App 20140174937 - Saito; Matsuko ;   et al.
2014-06-26
Electrolytic Copper Plating Liquid And The Electrolytic Copper Plating Method
App 20140097087 - SAITO; Mutsuko ;   et al.
2014-04-10
Electrolytic Copper Plating Solution And Method Of Electrolytic Copper Plating
App 20130319867 - SAITO; Mutsuko ;   et al.
2013-12-05
Tin Plating Solution
App 20120132530 - HAYASHI; Shinjiro ;   et al.
2012-05-31
Copper plating process
Grant 7,857,960 - Hayashi , et al. December 28, 2
2010-12-28
Copper plating bath formulation
Grant 7,857,961 - Hayashi , et al. December 28, 2
2010-12-28
Copper plating bath formulation
App 20090038951 - Hayashi; Shinjiro ;   et al.
2009-02-12
Copper plating process
App 20090038949 - Hayashi; Shinjiro ;   et al.
2009-02-12
Plating method
Grant 7,374,652 - Hayashi , et al. May 20, 2
2008-05-20
Plating method
App 20070007143 - Hayashi; Shinjiro ;   et al.
2007-01-11
Method for electrolytic copper plating
Grant 6,977,035 - Tsuchida , et al. December 20, 2
2005-12-20
Electrolytic copper plating solution and method for controlling the same
Grant 6,881,319 - Seita , et al. April 19, 2
2005-04-19
Electrolytic copper plating method
Grant 6,835,294 - Tsuchida , et al. December 28, 2
2004-12-28
Method for electrolytic copper plating
App 20040217008 - Tsuchida, Hideki ;   et al.
2004-11-04
Process for electrolytic copper plating
App 20040089557 - Tsuchida, Hideki ;   et al.
2004-05-13
Electrolytic copper plating solution and method for controlling the same
App 20030094376 - Seita, Masaru ;   et al.
2003-05-22
Electrolytic copper plating method
App 20030015433 - Tsuchida, Hideki ;   et al.
2003-01-23
Vibration damping device for a mechanical clutch release system
Grant 4,266,439 - Hayashi , et al. May 12, 1
1981-05-12

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