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Patent applications and USPTO patent grants for Hayashi; Reid K..The latest application filed is for "modular graft component junctions".
Patent | Date |
---|---|
Modular graft component junctions Grant 9,107,743 - Iancea , et al. August 18, 2 | 2015-08-18 |
Modular Graft Component Junctions App 20130123902 - Iancea; Octavian ;   et al. | 2013-05-16 |
Apparatus and method for electrically induced thrombosis Grant 8,197,478 - Hayashi , et al. June 12, 2 | 2012-06-12 |
Endovascular graft device and methods for attaching components thereof Grant 8,172,892 - Chuter , et al. May 8, 2 | 2012-05-08 |
Apparatus And Method For Electrically Induced Thrombosis App 20090240250 - HAYASHI; REID K. ;   et al. | 2009-09-24 |
Apparatus and method for electrically induced thrombosis Grant 7,458,974 - Hayashi , et al. December 2, 2 | 2008-12-02 |
Endovascular graft with pressure, temperature, flow and voltage sensors App 20060149347 - Hayashi; Reid K. ;   et al. | 2006-07-06 |
Endovascular graft with pressure, temperature, flow and voltage sensors Grant 7,025,778 - Hayashi , et al. April 11, 2 | 2006-04-11 |
Endovascular graft with pressure, temperature, flow and voltage sensors App 20030229388 - Hayashi, Reid K. ;   et al. | 2003-12-11 |
Electric endovascular implant depolyment system Grant 6,607,539 - Hayashi , et al. August 19, 2 | 2003-08-19 |
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