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Patent applications and USPTO patent grants for Hayashi; Osami.The latest application filed is for "method for the preparation of a hot-melt adhesive interconnector".
Patent | Date |
---|---|
Method for the preparation of a hot-melt adhesive interconnector Grant 5,041,183 - Nakamura , et al. August 20, 1 | 1991-08-20 |
Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby Grant 4,917,466 - Nakamura , et al. April 17, 1 | 1990-04-17 |
Colored ink ribbon of electrothermal transfer type for thermal printers Grant 4,775,578 - Hayashi , et al. October 4, 1 | 1988-10-04 |
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