Hayashi, Miki
USPTO Trademark & Patent Filings
Trademark applications and grants for Hayashi, Miki. Hayashi, Miki has 1 trademark applications. The latest application filed is for "QUENNY"
- Company Aliases
- Hayashi, Miki
- miki hayashi
- HAYASHI; Miki - Ibaraki-shi JP
- HAYASHI; Miki - Yokohama JP
- Hayashi; Miki - Osaka JP
- Hayashi; Miki - Ibaraki-shi JP
- Hayashi; Miki - Yokohama JP
- Hayashi; Miki - Ibaraki JP
| State Incorporated | CALIFORNIA |
| Entity Type | SOLE PROPRIETORSHIP |
| Address | cxy7878@hotmail.com 1117 Euclid Ave, San Gabriel, CALIFORNIA UNITED STATES 91776 |
Trademarks Patents
| Patent Application | Date |
|---|---|
| PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTING SEMICONDUCTOR ELEMENT 20220228037 - 17/572423 UENO; Taiki ; et al. | 2022-07-21 |
| RESOURCE MANAGEMENT DEVICE AND METHOD 20180124170 - 15/789665 HAYASHI; Miki ; et al. | 2018-05-03 |
| DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE 20130108847 - 13/725278 Hayashi; Miki ; et al. | 2013-05-02 |
| THERMOSETTING DIE-BONDING FILM 20120153508 - 13/141765 Hayashi; Miki ; et al. | 2012-06-21 |
| DIE BOND FILM, DICING DIE BOND FILM, AND SEMICONDUCTOR DEVICE 20110210455 - 13/036277 Oonishi; Kenji ; et al. | 2011-09-01 |
| Resource management device and method 10,666,721 - 15/789,665 Hayashi , et al. | 2020-05-26 |
| Dicing tape-integrated film for semiconductor back surface 8,912,665 - 13/725,278 Hayashi , et al. December 16, 2 | 2014-12-16 |
| Die bond film, dicing die bond film, and semiconductor device 8,779,586 - 13/036,277 Oonishi , et al. July 15, 2 | 2014-07-15 |
| Die bond film, dicing die bond film, and semiconductor device 8,779,586 - 13/036,277 Oonishi , et al. July 15, 2 | 2014-07-15 |
| Dicing tape-integrated film for semiconductor back surface 8,415,201 - 12/814,743 Hayashi , et al. April 9, 2 | 2013-04-09 |
Mark Image Registration | Serial | Trademark Application Date |
|---|---|
"QUENNY" 88754929 |
QUENNY 2020-01-10 |
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