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Patent applications and USPTO patent grants for Hayashi; Kunito.The latest application filed is for "aberration evaluation pattern, aberration evaluation method, aberration correction method, electron beam drawing apparatus, electron microscope, master, stamper, recording medium, and structure".
Patent | Date |
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Aberration evaluation pattern, aberration evaluation method, aberration correction method, electron beam drawing apparatus, electron microscope, master, stamper, recording medium, and structure Grant 8,158,310 - Miyata , et al. April 17, 2 | 2012-04-17 |
Aberration Evaluation Pattern, Aberration Evaluation Method, Aberration Correction Method, Electron Beam Drawing Apparatus, Electron Microscope, Master, Stamper, Recording Medium, And Structure App 20100227200 - Miyata; Hiroyuki ;   et al. | 2010-09-09 |
Electron-beam writing device and electron-beam writing method Grant 6,989,536 - Masuda , et al. January 24, 2 | 2006-01-24 |
Electron-beam writing device and electron-beam writing method App 20050018496 - Masuda, Osamu ;   et al. | 2005-01-27 |
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