| Patent | Date |
|---|
Thermoplastic Composition, Electrical Wire And Article Comprising The Electrical Wire
App 20210388202 - DAI; Mian ; et al. | 2021-12-16 |
Cutting tool and method of manufacturing machined product
Grant 10,792,738 - Hayashi October 6, 2 | 2020-10-06 |
Tip and drill
Grant 10,744,575 - Hayashi A | 2020-08-18 |
Tip And Drill
App 20190381584 - HAYASHI; Katsura | 2019-12-19 |
Cutting Tool And Method Of Manufacturing Machined Product
App 20190270150 - Hayashi; Katsura | 2019-09-05 |
Cutting Tool Tip, Cutting Tool, And Method For Producing Cut Workpiece Using Same
App 20190111496 - HAYASHI; Katsura | 2019-04-18 |
Wiring board and mounting structure using the same
Grant 9,936,583 - Hayashi April 3, 2 | 2018-04-03 |
Wiring board, mounting structure equipped with the wiring board, and method for manufacturing wiring board
Grant 9,814,136 - Hayashi , et al. November 7, 2 | 2017-11-07 |
Wiring substrate, component embedded substrate, and package structure
Grant 9,807,874 - Hayashi October 31, 2 | 2017-10-31 |
Wiring board, mounting structure using same, and method of manufacturing wiring board
Grant 9,693,451 - Nagasawa , et al. June 27, 2 | 2017-06-27 |
Wiring board and mounting: structure including the same
Grant 9,578,738 - Matsui , et al. February 21, 2 | 2017-02-21 |
Structure for circuit board used in electronic devices and method for manufacturing the same
Grant 9,485,877 - Hayashi November 1, 2 | 2016-11-01 |
Wiring Board And Mounting Structure Using The Same
App 20160278214 - HAYASHI; Katsura | 2016-09-22 |
Wiring Board, And Mounting Structure And Laminated Sheet Using The Same
App 20160242283 - HAYASHI; Katsura | 2016-08-18 |
Method For Producing Mounted Structure
App 20150366077 - KAWAI; Shinya ; et al. | 2015-12-17 |
Wiring Board, Mounting Structure Equipped With The Wiring Board, And Method For Manufacturing Wiring Board
App 20150305154 - HAYASHI; Katsura ; et al. | 2015-10-22 |
Electronic device
Grant 9,165,849 - Hatanaka , et al. October 20, 2 | 2015-10-20 |
Wiring Board And Mounting Structure Including The Same
App 20150296613 - Matsui; Takeshi ; et al. | 2015-10-15 |
Interposer and electronic device using the same
Grant 8,975,529 - Hayashi March 10, 2 | 2015-03-10 |
Circuit substrate, laminated board and laminated sheet
Grant 8,975,537 - Hayashi March 10, 2 | 2015-03-10 |
Wiring Board, Mounting Structure Using Same, And Method Of Manufacturing Wiring Board
App 20150037611 - Nagasawa; Tadashi ; et al. | 2015-02-05 |
Wiring Substrate, Component Embedded Substrate, And Package Structure
App 20140226290 - Hayashi; Katsura | 2014-08-14 |
Wiring board and mounting structure thereof
Grant 8,802,996 - Hayashi August 12, 2 | 2014-08-12 |
Circuit Substrate, Laminated Board And Laminated Sheet
App 20130256018 - HAYASHI; Katsura | 2013-10-03 |
Electronic Device
App 20130250527 - Hatanaka; Hidefumi ; et al. | 2013-09-26 |
Wiring Board And Mounting Structure Thereof
App 20130153279 - Hayashi; Katsura | 2013-06-20 |
Insulating Sheet, Method Of Manufacturing The Same, And Method Of Manufacturing Structure Using The Insulating Sheet
App 20130149514 - Hayashi; Katsura | 2013-06-13 |
Circuit substrate, laminated board and laminated sheet
Grant 8,461,462 - Hayashi June 11, 2 | 2013-06-11 |
Circuit board and mounting structure
Grant 8,446,734 - Hayashi , et al. May 21, 2 | 2013-05-21 |
Circuit board, mounting structure, and method for manufacturing circuit board
Grant 8,431,832 - Nagasawa , et al. April 30, 2 | 2013-04-30 |
Wire Substrate Structure
App 20130043067 - HAYASHI; Katsura | 2013-02-21 |
Interposer And Electronic Device Using The Same
App 20130027895 - Hayashi; Katsura | 2013-01-31 |
Structure And Method For Manufacturing The Same
App 20120189818 - Hayashi; Katsura | 2012-07-26 |
Structure And Method For Manufacturing The Same
App 20120189826 - Hayashi; Katsura | 2012-07-26 |
Optical waveguide member, optical wiring board, optical wiring module and method for manufacturing optical waveguide member and optical wiring board
Grant 8,045,829 - Hayashi , et al. October 25, 2 | 2011-10-25 |
Circuit Board And Structure Using The Same
App 20110232953 - Oga; Takeshi ; et al. | 2011-09-29 |
Fiber-reinforced resin and method for manufacturing the same
Grant 8,012,561 - Harazono , et al. September 6, 2 | 2011-09-06 |
Circuit Substrate, Laminated Board And Laminated Sheet
App 20110073358 - Hayashi; Katsura | 2011-03-31 |
Circuit Board, Mounting Structure, and Method for Manufacturing Circuit Board
App 20110051386 - Nagasawa; Tadashi ; et al. | 2011-03-03 |
Circuit Board and Mounting Structure
App 20100259910 - Hayashi; Katsura ; et al. | 2010-10-14 |
Method For Manufacturing Resin Substrate
App 20100255286 - MATSUMOTO; Keisaku ; et al. | 2010-10-07 |
Fiber-Reinforced Resin and Method for Manufacturing the Same
App 20100136284 - Harazono; Masaaki ; et al. | 2010-06-03 |
Circuit Board And Semiconductor Element Mounted Structure Using The Same
App 20100065318 - Nagasawa; Tadashi ; et al. | 2010-03-18 |
Optical Waveguide Member, Optical Wiring Board, Optical Wiring Module And Method For Manufacturing Optical Waveguide Member And Optical Wiring Board
App 20100061679 - Hayashi; Katsura ; et al. | 2010-03-11 |
Wiring Board and Semiconductor Device
App 20070285907 - NISHIKAWA; Hiroyuki ; et al. | 2007-12-13 |
Wiring substrate for mounting semiconductor components
Grant 7,271,476 - Nishikawa , et al. September 18, 2 | 2007-09-18 |
Transfer sheet and production method of the same and wiring board and production method of the same
Grant 6,936,336 - Matsunaga , et al. August 30, 2 | 2005-08-30 |
Wiring board and semiconductor device
App 20050087850 - Nishikawa, Hiroyuki ; et al. | 2005-04-28 |
Film with metal foil
Grant 6,866,739 - Nishimoto , et al. March 15, 2 | 2005-03-15 |
Multi-layer wiring substrate
Grant 6,663,946 - Seri , et al. December 16, 2 | 2003-12-16 |
Transfer sheet and production method of the same and wiring board and production method of the same
App 20030178227 - Matsunaga, Takahiro ; et al. | 2003-09-25 |
Film with metal foil
App 20030034125 - Nishimoto, Akihiko ; et al. | 2003-02-20 |
Multi-layer wiring substrate
App 20020172021 - Seri, Takuji ; et al. | 2002-11-21 |
Film with metal foil
Grant 6,451,441 - Nishimoto , et al. September 17, 2 | 2002-09-17 |
Dicyclopentadiene-modified unsaturated polyester and process for producing the same as well as resin composition and molding material each containing unsaturated polyester
Grant 6,384,151 - Matsukawa , et al. May 7, 2 | 2002-05-07 |
Electric element incorporating wiring board
Grant 6,370,013 - Iino , et al. April 9, 2 | 2002-04-09 |
Electrical device mounting wiring board and method of producing the same
Grant 6,359,235 - Hayashi March 19, 2 | 2002-03-19 |
Wiring board
Grant 6,207,259 - Iino , et al. March 27, 2 | 2001-03-27 |
Process for producing a multi-layer wiring board
Grant 6,143,116 - Hayashi , et al. November 7, 2 | 2000-11-07 |
High-strength alumina sintered body and process for preparation thereof
Grant 5,082,809 - Hayashi January 21, 1 | 1992-01-21 |
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