Hayashi; Hiromasa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hayashi; Hiromasa.The latest application filed is for "semiconductor device".

Company Profile

4.24.24

Hayashi; Hiromasa - Kariya JP
Hayashi; Hiromasa - Kawasaki JP
HAYASHI; Hiromasa - Kariya-city JP
Hayashi; Hiromasa - Obu JP
Hayashi; Hiromasa - Tokyo JP
Hayashi; Hiromasa - Miyoshi N/A JP
Hayashi; Hiromasa - Aichi JP
HAYASHI; Hiromasa - Obu-city JP
HAYASHI; Hiromasa - Miyoshi-shi JP
Hayashi; Hiromasa - Okegawa N/A JP
Hayashi; Hiromasa - Okegawa-shi JP
Hayashi; Hiromasa - Oobu JP
Hayashi; Hiromasa - Kawasaki-shi JP
Hayashi, Hiromasa - Oobu-shi JP
Hayashi, Hiromasa - Nukata-gun JP
Hayashi, Hiromasa - Oobu-city JP
Hayashi; Hiromasa - Kamakura JP
Hayashi; Hiromasa - Chiba JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device Grant 10,998,295 - Hayashi , et al. May 4, 2	2021-05-04
Method of cutting and removing adhesive matter at end of cuboid metal material and removal apparatus Grant 10,391,573 - Kojo , et al. A	2019-08-27
Semiconductor Device App 20190221549 - HAYASHI; Hiromasa ; et al.	2019-07-18
Shunt Resistor And Method Of Mounting The Same App 20190146007 - TAKAISHI; Junpei ; et al.	2019-05-16
Electronic device and manufacturing method of electronic device Grant 9,922,906 - Nagaya , et al. March 20, 2	2018-03-20
Manufacturing method of power-module substrate Grant 9,579,739 - Oohiraki , et al. February 28, 2	2017-02-28
Method Of Cutting And Removing Adhesive Matter At End Of Cuboid Metal Material And Removal Apparatus App 20160167149 - Kojo; Rinya ; et al.	2016-06-16
Manufacturing Method Of Power-module Substrate App 20160001388 - Oohiraki; Tomoya ; et al.	2016-01-07
Wiring member and semiconductor module having the same Grant 9,123,711 - Fujita , et al. September 1, 2	2015-09-01
Insulating substrate, method of manufacturing the same, and semiconductor device Grant 9,112,018 - Hayashi August 18, 2	2015-08-18
Semiconductor module with switching elements Grant 9,006,883 - Fujita , et al. April 14, 2	2015-04-14
Solder Paste App 20150027589 - Okada; Sakie ; et al.	2015-01-29
Electronic Device And Manufacturing Method Of Electronic Device App 20140347838 - NAGAYA; Toshihiro ; et al.	2014-11-27
Insulating Substrate, Method Of Manufacturing The Same, And Semiconductor Device App 20140291814 - HAYASHI; Hiromasa	2014-10-02
Semiconductor module device and driving apparatus having the same Grant 8,649,159 - Fujita , et al. February 11, 2	2014-02-11
Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrate Grant 8,637,777 - Hayashi , et al. January 28, 2	2014-01-28
Wiring Member And Semiconductor Module Having The Same App 20130307129 - FUJITA; Toshihiro ; et al.	2013-11-21
Semiconductor Module With Switching Elements App 20130221532 - FUJITA; Toshihiro ; et al.	2013-08-29
Semiconductor module device and driving apparatus having the same Grant 8,471,417 - Fujita , et al. June 25, 2	2013-06-25
Laser welding structure Grant 8,415,027 - Hayashi , et al. April 9, 2	2013-04-09
Semiconductor module device and driving apparatus having the same App 20110285336 - Fujita; Toshihiro ; et al.	2011-11-24
Semiconductor module device and driving apparatus having the same App 20110285226 - Fujita; Toshihiro ; et al.	2011-11-24
Power Module Substrate Having Heatsink, Method For Manufacturing The Same, Power Module Having Heatsink, And Power Module Substrate App 20110017496 - Hayashi; Hiromasa ; et al.	2011-01-27
Laser welding structure and laser welding method App 20090236321 - Hayashi; Hiromasa ; et al.	2009-09-24
Process for producing hot-rolled steel strip and apparatus therefor Grant 7,448,244 - Aoe , et al. November 11, 2	2008-11-11
Tire rotation assisting apparatus Grant 7,308,344 - Hayashi December 11, 2	2007-12-11
Waste heat recovery apparatus, waste heat recovery system, and method of recovering waste heat App 20070183966 - Nakagawa; Tsuguhiko ; et al.	2007-08-09
Tire air pressure detection system Grant 7,168,306 - Hayashi January 30, 2	2007-01-30
Process for producing hot-rolled steel strip and apparatus therefor App 20060010951 - Aoe; Shinichiro ; et al.	2006-01-19
Tire rotation assisting apparatus App 20050256619 - Hayashi, Hiromasa	2005-11-17
Semiconductor device and method for manufacturing the same App 20050231925 - Fukuda, Yutaka ; et al.	2005-10-20
Apparatus and method for tire monitoring system Grant 6,954,141 - Sekizawa , et al. October 11, 2	2005-10-11
Apparatus And Method For Tire Monitoring System App 20050162264 - Sekizawa, Takatoshi ; et al.	2005-07-28
Tire air pressure detection system App 20050132791 - Hayashi, Hiromasa	2005-06-23
Tire pressure monitoring system and method for registering identification code in the same Grant 6,897,769 - Hayashi , et al. May 24, 2	2005-05-24
Tire pressure monitoring system and method for registering identification code in the same App 20040090324 - Hayashi, Hiromasa ; et al.	2004-05-13
Burr removing method and apparatus Grant 6,648,564 - Yamashita , et al. November 18, 2	2003-11-18
Burr removing method and apparatus App 20030129034 - Yamashita, Koji ; et al.	2003-07-10
Methods of producing steel plate, hot-dip steel plate and alloyed hot-dip steel plate Grant 6,398,884 - Kyono , et al. June 4, 2	2002-06-04
Burr removing method and apparatus App 20020061237 - Yamashita, Koji ; et al.	2002-05-23
Burr removing method and apparatus App 20010022921 - Yamashita, Koji ; et al.	2001-09-20
IC socket having a backup power cell and circuit Grant 4,646,132 - Kuwabara , et al. February 24, 1	1987-02-24