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name:-0.035769939422607
name:-0.022419929504395
name:-0.0035250186920166
HAYASHI; Hirokazu Patent Filings

HAYASHI; Hirokazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for HAYASHI; Hirokazu.The latest application filed is for "thread".

Company Profile
3.23.32
  • HAYASHI; Hirokazu - Osaka JP
  • HAYASHI; Hirokazu - Osaka-shi Osaka
  • HAYASHI; Hirokazu - Tokyo JP
  • Hayashi; Hirokazu - Ibo Hyogo JP
  • Hayashi; Hirokazu - Miyoshi N/A JP
  • Hayashi; Hirokazu - Komaki JP
  • Hayashi; Hirokazu - Komaki-shi JP
  • Hayashi; Hirokazu - Miyoshi-shi JP
  • HAYASHI; Hirokazu - Hyogo-ken JP
  • Hayashi; Hirokazu - Aichi-ken JP
  • Hayashi, Hirokazu - Minato-ku JP
  • Hayashi; Hirokazu - Yaita JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Thread
App 20220235496 - INOUE; Takafumi ;   et al.
2022-07-28
Cylindrical Structure
App 20220228300 - INOUE; Takafumi ;   et al.
2022-07-21
Deep-body-temperature estimation system, heat stress warning system, and deep-body-temperature estimation method
Grant 11,291,373 - Kimura , et al. April 5, 2
2022-04-05
Deep-body-temperature Estimation System, Heat Stress Warning System, And Deep-body-temperature Estimation Method
App 20200367758 - KIMURA; Tasuku ;   et al.
2020-11-26
Currency Exchange System And Remittance System
App 20200327612 - HAYASHI; Hirokazu
2020-10-15
Article Provided With Warning System
App 20190122517 - KIMURA; Tasuku ;   et al.
2019-04-25
Removal device for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus
Grant 9,957,611 - Hayashi May 1, 2
2018-05-01
Cationic electrodeposition coating composition and coated article
Grant 9,617,650 - Okada , et al. April 11, 2
2017-04-11
Removal Device For Semiconductor Manufacturing Apparatus And Semiconductor Manufacturing Apparatus
App 20170067152 - Hayashi; Hirokazu
2017-03-09
Seal member for fuel cell and fuel cell seal body using same
Grant 9,543,596 - Yamamoto , et al. January 10, 2
2017-01-10
Seal Member For Fuel Cell And Fuel Cell Seal Body Using Same
App 20150288004 - Yamamoto; Kenji ;   et al.
2015-10-08
Rubber Composition And Fuel Cell Sealed Body
App 20140287340 - Yamamoto; Kenji ;   et al.
2014-09-25
Cationic Electrodeposition Coating Composition And Coated Article
App 20140042031 - Okada; Eisaku ;   et al.
2014-02-13
Semiconductor Device And Method For Manufacturing The Same
App 20130221498 - HAYASHI; Hirokazu
2013-08-29
Method for forming coating film
Grant 8,414,753 - Okada , et al. April 9, 2
2013-04-09
ESD protection device and manufacturing method thereof
Grant 8,159,033 - Hayashi April 17, 2
2012-04-17
Method For Forming Coating Film
App 20110068009 - Okada; Eisaku ;   et al.
2011-03-24
Semiconductor device using SOI-substrate
Grant 7,859,063 - Hayashi December 28, 2
2010-12-28
Semiconductor integrated circuit
Grant 7,729,096 - Hayashi June 1, 2
2010-06-01
Load driving device
Grant 7,723,794 - Kuroda , et al. May 25, 2
2010-05-25
Electro-static discharge protection circuit and semiconductor device having the same
Grant 7,671,415 - Kuroda , et al. March 2, 2
2010-03-02
ESD protection device and manufacturing method thereof
App 20090242993 - Hayashi; Hirokazu
2009-10-01
Semiconductor Device Using Soi-substrate
App 20090152630 - HAYASHI; Hirokazu
2009-06-18
Semiconductor device having electrostatic discharge element
Grant 7,521,713 - Hayashi April 21, 2
2009-04-21
Electro-static discharge protection circuit and semiconductor device having the same
Grant 7,498,615 - Kuroda , et al. March 3, 2
2009-03-03
Evaluation TEG for semiconductor device and method of evaluation
Grant RE40,597 - Hayashi December 2, 2
2008-12-02
Design and simulation methods for electrostatic protection circuits
Grant 7,434,179 - Hayashi October 7, 2
2008-10-07
Semiconductor integrated circuit
App 20080225450 - Hayashi; Hirokazu
2008-09-18
Breeding Support System
App 20080147458 - Yamazaki; Akihiro ;   et al.
2008-06-19
Polyester Pile Fabric Having Excellent Soft Hand, Abrasion Resistance And Bathochromic Effect
App 20080020173 - Fukunaga; Migifumi ;   et al.
2008-01-24
Electrostatic discharge protection device modeling method and electrostatic discharge simulation method
Grant 7,302,378 - Hayashi November 27, 2
2007-11-27
Pile Fabric And Method For Producing The Same
App 20070215231 - Hayashi; Hirokazu ;   et al.
2007-09-20
Method of evaluating semiconductor device
Grant 7,268,003 - Hayashi September 11, 2
2007-09-11
Pile fabric and method for producing the same
App 20070122585 - Fukuro; Tadayuki ;   et al.
2007-05-31
Method for modeling semiconductor device process
Grant 7,197,439 - Hayashi March 27, 2
2007-03-27
Load driving device
App 20070052033 - Kuroda; Toshikazu ;   et al.
2007-03-08
Electro-static Discharge Protection Circuit And Semiconductor Device Having The Same
App 20060220137 - KURODA; Toshikazu ;   et al.
2006-10-05
Design and simulation methods for electrostatic protection circuits
App 20060194382 - Hayashi; Hirokazu
2006-08-31
Semiconductor device and method of producing the same
App 20060054892 - Hayashi; Hirokazu
2006-03-16
Evaluation TEG for semiconductor device and method of evaluation
Grant 7,000,201 - Hayashi February 14, 2
2006-02-14
Method for modeling semiconductor device and network
Grant 6,981,236 - Hayashi December 27, 2
2005-12-27
Semiconductor device and method of manufacturing the same
App 20050275030 - Hayashi, Hirokazu
2005-12-15
Method of evaluating semiconductor device
App 20050196884 - Hayashi, Hirokazu
2005-09-08
ESD protection device modeling method and ESD simulation method
App 20050065762 - Hayashi, Hirokazu
2005-03-24
Method for modeling semiconductor device and network
App 20040210858 - Hayashi, Hirokazu
2004-10-21
Evaluation TEG for semiconductor device and method of evaluation
App 20040163071 - Hayashi, Hirokazu
2004-08-19
Method for modeling semiconductor device process
App 20020183991 - Hayashi, Hirokazu
2002-12-05
SOI structure semiconductor device and a fabrication method thereof
App 20010036710 - Hayashi, Hirokazu ;   et al.
2001-11-01
Method for modeling diffusion of impurities in a semiconductor
App 20010025367 - Hayashi, Hirokazu
2001-09-27
Method of fabricating a SOI structure semiconductor device
Grant 6,277,684 - Hayashi , et al. August 21, 2
2001-08-21
Projected image displaying apparatus and a method of correcting color unevenness therein
Grant 5,452,019 - Fukuda , et al. September 19, 1
1995-09-19

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