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Hayashi; Akinari Patent Filings

Hayashi; Akinari

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hayashi; Akinari.The latest application filed is for "power feed joint structure of power control unit".

Company Profile
2.10.10
  • Hayashi; Akinari - Wako JP
  • Hayashi; Akinari - Toyama JP
  • Hayashi; Akinari - Wako-shi JP
  • HAYASHI; Akinari - Toyama-shi JP
  • Hayashi; Akinari - Saitama JP
  • Hayashi; Akinari - Toyamashi JP
  • Hayashi; Akinari - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Power control unit
Grant 11,336,156 - Kunii , et al. May 17, 2
2022-05-17
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
Grant 11,203,488 - Hayashi December 21, 2
2021-12-21
Substrate transfer unit, and substrate processing apparatus
Grant 10,847,397 - Hayashi November 24, 2
2020-11-24
Power Feed Joint Structure Of Power Control Unit
App 20200274420 - Kunii; Hiroshi ;   et al.
2020-08-27
Power Control Unit
App 20200274424 - Kunii; Hiroshi ;   et al.
2020-08-27
Substrate processing apparatus, substrate container transport system and operation mechanism
Grant 10,703,565 - Hayashi
2020-07-07
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medi
App 20200180865 - HAYASHI; Akinari
2020-06-11
Substrate Transfer Unit, And Substrate Processing Apparatus
App 20200020560 - HAYASHI; Akinari
2020-01-16
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
Grant 10,519,543 - Hayashi Dec
2019-12-31
Substrate Processing Apparatus, Method Of Manufacturing Semiconductor Device, And Recording Medium
App 20190093219 - HAYASHI; Akinari
2019-03-28
Substrate Processing Apparatus, Substrate Container Transport System And Operation Mechanism
App 20180265294 - HAYASHI; Akinari
2018-09-20
Substrate processing apparatus, purging apparatus, method of manufacturing semiconductor device, and recording medium
Grant 9,695,509 - Hirano , et al. July 4, 2
2017-07-04
Connection unit
Grant 9,564,706 - Ozawa , et al. February 7, 2
2017-02-07
Connection Unit
App 20140364016 - Ozawa; Hiroyuki ;   et al.
2014-12-11
Semiconductor manufacturing apparatus and semiconductor device manufacturing method
Grant 8,777,553 - Hirano , et al. July 15, 2
2014-07-15
Substrate Processing Apparatus, Purging Apparatus, Method Of Manufacturing Semiconductor Device, And Recording Medium
App 20140112739 - HIRANO; Makoto ;   et al.
2014-04-24
Semiconductor Manufacturing Apparatus And Semiconductor Device Manufacturing Method
App 20120289058 - Hirano; Makoto ;   et al.
2012-11-15
Semiconductor Manufacturing Apparatus And Semiconductor Device Manufacturing Method
App 20080236487 - Hirano; Makoto ;   et al.
2008-10-02
Substrate processing apparatus and substrate processing method
Grant 6,582,174 - Hayashi June 24, 2
2003-06-24

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