loadpatents
name:-0.029258012771606
name:-0.028110027313232
name:-0.017421960830688
Hayasaka; Noboru Patent Filings

Hayasaka; Noboru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hayasaka; Noboru.The latest application filed is for "connector".

Company Profile
18.24.26
  • Hayasaka; Noboru - Shizuoka JP
  • - Shizuoka JP
  • Hayasaka; Noboru - Kawasaki JP
  • Hayasaka; Noboru - Kawasaki-shi JP
  • Hayasaka; Noboru - Oizumi-machi JP
  • Hayasaka; Noboru - Ora JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Connector having structure for separating connector from connection target
Grant 11,121,501 - Tanaka , et al. September 14, 2
2021-09-14
Connector
App 20210273374 - Tanaka; Yasuhiro ;   et al.
2021-09-02
Connector and connector structure
Grant 11,005,216 - Hayasaka , et al. May 11, 2
2021-05-11
Connector and wire harness
Grant 11005208 -
2021-05-11
Shielded connector
Grant 10,971,854 - Tanaka , et al. April 6, 2
2021-04-06
Fitting connector
Grant 10,847,918 - Tanaka , et al. November 24, 2
2020-11-24
Fitting connector
Grant 10,770,834 - Tanaka , et al. Sep
2020-09-08
Connector
App 20200203882 - Tanaka; Yasuhiro ;   et al.
2020-06-25
Fitting Connector
App 20200153149 - Tanaka; Yasuhiro ;   et al.
2020-05-14
Fitting Connector
App 20200144769 - Tanaka; Yasuhiro ;   et al.
2020-05-07
Fitting Connector
App 20200136307 - Tanaka; Yasuhiro ;   et al.
2020-04-30
Connector And Wire Harness
App 20200136296 - Tanaka; Yasuhiro ;   et al.
2020-04-30
Shielded Connector
App 20200076116 - Tanaka; Yasuhiro ;   et al.
2020-03-05
Connector And Connector Structure
App 20200067232 - Hayasaka; Noboru ;   et al.
2020-02-27
Device direct-mounting shield connector
Grant 10,505,319 - Hayasaka , et al. Dec
2019-12-10
Shield Connector
App 20190341725 - Tanaka; Yasuhiro ;   et al.
2019-11-07
Shield connector
Grant 10,461,480 - Tanaka , et al. Oc
2019-10-29
Attachment structure of shield connector for directly mounting on device
Grant 10,236,639 - Hayasaka , et al.
2019-03-19
Device Direct-mounting Shield Connector
App 20190067877 - Hayasaka; Noboru ;   et al.
2019-02-28
Attachment Structure Of Shield Connector For Directly Mounting On Device
App 20190052029 - Hayasaka; Noboru ;   et al.
2019-02-14
Fitting connector
Grant 10,069,241 - Hayasaka September 4, 2
2018-09-04
Fitting Connector
App 20180226748 - Hayasaka; Noboru
2018-08-09
Female and male connectors
Grant 10,044,149 - Tanaka , et al. August 7, 2
2018-08-07
Connector having integrated housing and shield shell
Grant 10,027,054 - Takeshita , et al. July 17, 2
2018-07-17
Connector
App 20170338587 - Takeshita; Yuhei ;   et al.
2017-11-23
Female And Male Connectors
App 20170338600 - Tanaka; Yasuhiro ;   et al.
2017-11-23
Image pickup apparatus and method of manufacturing the same
Grant 8,009,222 - Watanabe , et al. August 30, 2
2011-08-30
Method of resin sealing electronic part
Grant 7,923,303 - Akutagawa , et al. April 12, 2
2011-04-12
Method Of Resin Sealing Electronic Part
App 20100052212 - AKUTAGAWA; Yoshito ;   et al.
2010-03-04
Method of resin sealing electronic part
Grant 7,638,367 - Akutagawa , et al. December 29, 2
2009-12-29
Vacuum fixing jig for semiconductor device
Grant 7,571,538 - Teshirogi , et al. August 11, 2
2009-08-11
Jig for a semiconductor substrate
Grant 7,395,847 - Teshirogi , et al. July 8, 2
2008-07-08
Method of resin sealing electronic part
App 20070196957 - Akutagawa; Yoshito ;   et al.
2007-08-23
Image pickup apparatus and method of manufacturing the same
App 20070091198 - Watanabe; Naoyuki ;   et al.
2007-04-26
Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices
App 20070065653 - Meguro; Kouichi ;   et al.
2007-03-22
Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices
Grant 7,157,311 - Meguro , et al. January 2, 2
2007-01-02
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
Grant 7,109,561 - Teshirogi , et al. September 19, 2
2006-09-19
Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material
Grant 7,056,770 - Uragami , et al. June 6, 2
2006-06-06
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
App 20050221589 - Teshirogi, Kazuo ;   et al.
2005-10-06
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
App 20050221588 - Teshirogi, Kazuo ;   et al.
2005-10-06
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
App 20050221587 - Teshirogi, Kazuo ;   et al.
2005-10-06
Method of making semiconductor device that has improved structural strength
Grant 6,951,800 - Shinjo , et al. October 4, 2
2005-10-04
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
Grant 6,902,944 - Teshirogi , et al. June 7, 2
2005-06-07
Method of Manufacturing a Semiconductor Device and a Method for Fixing the Semiconductor Device Using Substrate Jig
App 20040161882 - TESHIROGI, Kazuo ;   et al.
2004-08-19
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
Grant 6,750,074 - Teshirogi , et al. June 15, 2
2004-06-15
Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices
App 20040099943 - Meguro, Kouichi ;   et al.
2004-05-27
Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material
App 20040101631 - Uragami, Hiroshi ;   et al.
2004-05-27
Method of making semiconductor device that has improved structural strength
App 20030077880 - Shinjo, Yoshiaki ;   et al.
2003-04-24
Semiconductor substrate jig and method of manufacturing a semiconductor device
App 20030077854 - Teshirogi, Kazuo ;   et al.
2003-04-24
Communication control system for transmitting, from one data processing device to another, data of different formats along with an identification of the format and its corresponding DMA controller
Grant 5,588,120 - Shitara , et al. December 24, 1
1996-12-24
Communication control system for transmitting, from one data processing device to another, data along with an identification of the address at which the data is to be stored upon reception
Grant 5,430,844 - Shitara , et al. July 4, 1
1995-07-04

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