Hayasaka; Junya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hayasaka; Junya.The latest application filed is for "method for manufacturing liquid-discharge-head substrate".

Company Profile

1.4.4

Hayasaka; Junya - Funabashi JP
Hayasaka; Junya - Funabashi-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing liquid-discharge-head substrate Grant 10,166,779 - Sujaku , et al. J	2019-01-01
Method for producing liquid-ejection-head substrate and liquid-ejection-head substrate produced by the same Grant 9,610,773 - Ibe , et al. April 4, 2	2017-04-04
Method For Manufacturing Liquid-discharge-head Substrate App 20160229183 - Sujaku; Shiro ; et al.	2016-08-11
Method For Producing Liquid-ejection-head Substrate And Liquid-ejection-head Substrate Produced By The Same App 20160229184 - Ibe; Satoshi ; et al.	2016-08-11
Device substrate, liquid ejection head, and method for manufacturing device substrate and liquid ejection head Grant 9,108,406 - Hasegawa , et al. August 18, 2	2015-08-18
Liquid ejection head and printing apparatus Grant 9,085,141 - Oya , et al. July 21, 2	2015-07-21
Liquid Ejection Head And Printing Apparatus App 20150062260 - OYA; Shuhei ; et al.	2015-03-05
Device Substrate, Liquid Ejection Head, And Method For Manufacturing Device Substrate And Liquid Ejection Head App 20140340451 - Hasegawa; Kouji ; et al.	2014-11-20

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