Hayano; Seiji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hayano; Seiji.The latest application filed is for "powder bed fusion apparatus".
- Hayano; Seiji - Inagi JP
- HAYANO; Seiji - Inagi-shi JP
- Hayano; Seiji - Tokyo JP
| Patent | Date |
|---|---|
| Powder bed fusion apparatus Grant 10,427,218 - Hayano October 1, 2 | 2019-10-01 |
| Powder Bed Fusion Apparatus App 20170001243 - HAYANO; Seiji | 2017-01-05 |
| Apparatus for solidifying and shaping optically cured fluid by carrying out scanning simultaneously with recoating Grant 5,780,070 - Yamazawa , et al. July 14, 1 | 1998-07-14 |
| Photo-solidification modeling apparatus and photo-solidification modeling method having an improved recoating process Grant 5,432,045 - Narukawa , et al. July 11, 1 | 1995-07-11 |
| Photo-solidification modeling device Grant 5,253,177 - Saito , et al. October 12, 1 | 1993-10-12 |
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