Hayama; Junpei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hayama; Junpei.The latest application filed is for "coil component and wireless communication circuit using the same".
- Hayama; Junpei - Tokyo JP
| Patent | Date |
|---|---|
| Resin composition, resin cured product and resin substrate Grant 11,434,359 - Inagaki , et al. September 6, 2 | 2022-09-06 |
| Coil Component And Wireless Communication Circuit Using The Same App 20220059938 - MATSUSHIMA; Masaki ; et al. | 2022-02-24 |
| Coil component Grant D922,323 - Chiyo , et al. June 15, 2 | 2021-06-15 |
| Resin Composition, Resin Cured Product And Resin Substrate App 20210070978 - INAGAKI; Takashi ; et al. | 2021-03-11 |
| Coil Component App 20200274392 - CHIYO; Noritaka ; et al. | 2020-08-27 |
| Coil Component App 20200135382 - HAYAMA; Junpei ; et al. | 2020-04-30 |
| Coil Component App 20190148053 - KANEKO; Shigeru ; et al. | 2019-05-16 |
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