Hayakawa; Yukihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hayakawa; Yukihiro.The latest application filed is for "solid-state imaging apparatus, method of manufacturing the same, and camera".

Company Profile

0.30.29

Hayakawa; Yukihiro - Yokohama JP
Hayakawa; Yukihiro - Yokohama-shi JP
Hayakawa; Yukihiro - Kanagawa N/A JP
Hayakawa; Yukihiro - Kawasaki JP
Hayakawa; Yukihiro - Atsugi JP
HAYAKAWA, YUKIHIRO - ATSUGI-SHI JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solid-state imaging apparatus, method of manufacturing the same, and camera Grant 9,769,401 - Ogino , et al. September 19, 2	2017-09-19
Solid-state Imaging Apparatus, Method Of Manufacturing The Same, And Camera App 20160373665 - Ogino; Takumi ; et al.	2016-12-22
Method of manufacturing solid-state image pickup apparatus Grant 9,373,659 - Tezuka , et al. June 21, 2	2016-06-21
Manufacturing Method Of Imaging Apparatus, Imaging Apparatus, And Imaging System App 20160156817 - Tezuka; Tomoyuki ; et al.	2016-06-02
Method Of Manufacturing Solid-state Image Pickup Apparatus App 20160104742 - Tezuka; Tomoyuki ; et al.	2016-04-14
Information processing unit, printing control method for printer driver, and computer program product Grant 9,280,727 - Yamashita , et al. March 8, 2	2016-03-08
Print Control Method And Recording Medium Storing Print Control Program App 20160004484 - YAMAMOTO; Teruyoshi ; et al.	2016-01-07
Function Setting Method And Recording Medium App 20150301769 - YAMASHITA; Yuu ; et al.	2015-10-22
Information Processing Unit, Printing Control Method For Printer Driver, And Computer Program Product App 20150206035 - YAMASHITA; Yuu ; et al.	2015-07-23
Solid-state image sensor with light-guiding portion Grant 9,030,587 - Suzuki , et al. May 12, 2	2015-05-12
Printer driver Grant 8,842,338 - Hayakawa , et al. September 23, 2	2014-09-23
Through-hole forming method and inkjet head Grant 8,771,528 - Sasaki , et al. July 8, 2	2014-07-08
Solid-state Image Sensor App 20130314576 - Suzuki; Kentarou ; et al.	2013-11-28
Through-hole Forming Method And Inkjet Head App 20130168828 - Sasaki; Keiichi ; et al.	2013-07-04
Through-hole forming method, inkjet head, and silicon substrate Grant 8,409,452 - Sasaki , et al. April 2, 2	2013-04-02
Printer Driver App 20130003098 - Hayakawa; Yukihiro ; et al.	2013-01-03
Method for increasing/reducing band data rate of ring-based network and node apparatus of the ring-based network Grant 7,983,154 - Okuda , et al. July 19, 2	2011-07-19
Through-hole Forming Method, Inkjet Head, And Silicon Substrate App 20090073228 - Sasaki; Keiichi ; et al.	2009-03-19
Circuit board and liquid discharging apparatus Grant 7,270,398 - Sasaki , et al. September 18, 2	2007-09-18
Structure with through hole, production method thereof, and liquid discharge head Grant 7,270,759 - Hayakawa , et al. September 18, 2	2007-09-18
Method for producing circuit substrate Grant 7,244,370 - Sasaki , et al. July 17, 2	2007-07-17
Method for increasing/reducing band data rate of ring-based network and node apparatus of the ring-based network App 20070070899 - Okuda; Takashi ; et al.	2007-03-29
Heat generating resistant element film, substrate for ink jet head utilizing the same, ink jet head and ink jet apparatus Grant 7,055,937 - Suzuki , et al. June 6, 2	2006-06-06
Semiconductor device, method for manufacturing the same, and liquid jet apparatus Grant 7,056,798 - Shimotsusa , et al. June 6, 2	2006-06-06
Structure with through hole, production method thereof, and liquid discharge head App 20060068570 - Hayakawa; Yukihiro ; et al.	2006-03-30
Structure with through hole, production method thereof, and liquid discharge head Grant 7,018,020 - Hayakawa , et al. March 28, 2	2006-03-28
Heating resistor film, recording head substrate, recording head, and recording apparatus Grant 6,964,471 - Tamura , et al. November 15, 2	2005-11-15
Substrate for ink jet recording head, ink jet recording head and ink jet recording apparatus using ink jet recording head Grant 6,962,405 - Imanaka , et al. November 8, 2	2005-11-08
Circuit board and liquid discharging apparatus App 20050078152 - Sasaki, Keiichi ; et al.	2005-04-14
Method for producing liquid discharge head Grant 6,875,365 - Watanabe , et al. April 5, 2	2005-04-05
Semiconductor device and liquid jetting device using the same Grant 6,867,457 - Hayakawa , et al. March 15, 2	2005-03-15
Method for producing circuit substrate App 20050031996 - Sasaki, Keiichi ; et al.	2005-02-10
Manufacturing method of circuit board, circuit board, and liquid discharging apparatus Grant 6,838,351 - Sasaki , et al. January 4, 2	2005-01-04
Semiconductor device, method for manufacturing the same, and liquid jet apparatus Grant 6,825,543 - Shimotsusa , et al. November 30, 2	2004-11-30
Structure provided with through hole, method of manufacture therefor, and liquid discharge head Grant 6,799,839 - Hayakawa , et al. October 5, 2	2004-10-05
Manufacturing method of circuit board, circuit board, and liquid discharging apparatus App 20040191982 - Sasaki, Keiichi ; et al.	2004-09-30
Heat generating resistant element film, substrate for ink jet head utilizing the same, ink jet head and ink jet apparatus App 20040179084 - Suzuki, Hiroyuki ; et al.	2004-09-16
Substrate for ink jet recording head, ink jet recording head and ink jet recording apparatus using ink jet recording head App 20040160485 - Imanaka, Yoshiyuki ; et al.	2004-08-19
Semiconductor device, method for manufacturing the same, and liquid jet apparatus App 20040046211 - Shimotsusa, Mineo ; et al.	2004-03-11
Semiconductor device and liquid jetting device using the same App 20040007767 - Hayakawa, Yukihiro ; et al.	2004-01-15
Structure provided with through hole, method of manufacture therefor, and liquid discharge head App 20030081068 - Hayakawa, Yukihiro ; et al.	2003-05-01
Structure with through hole, production method thereof, and liquid discharge head App 20030080359 - Hayakawa, Yukihiro ; et al.	2003-05-01
Heating resistor film, recording head substrate, recording head, and recording apparatus App 20030076384 - Tamura, Seiichi ; et al.	2003-04-24
Method for producing liquid discharge head App 20030034326 - Watanabe, Hidenori ; et al.	2003-02-20
Method for forming a thin film using a gas Grant 6,475,563 - Hayakawa , et al. November 5, 2	2002-11-05
Substrate unit for liquid discharging head, method for producing the same, liquid discharging head, cartridge, and image forming apparatus Grant 6,467,884 - Murooka , et al. October 22, 2	2002-10-22
Semiconductor device, method for manufacturing the same, and liquid jet apparatus App 20020125540 - Shimotsusa, Mineo ; et al.	2002-09-12
Method For Forming A Thin Film Using A Gas App 20020076489 - HAYAKAWA, YUKIHIRO ; et al.	2002-06-20
Transmission equipment having interface conversion function App 20020018488 - Ohnuma, Kazuhiro ; et al.	2002-02-14
Method of producing a through-hole, silicon substrate having a through-hole, device using such a substrate, method of producing an ink-jet print head, and ink-jet print head Grant 6,143,190 - Yagi , et al. November 7, 2	2000-11-07
Chemical vapor deposition apparatus Grant 5,776,255 - Asaba , et al. July 7, 1	1998-07-07
Chemical vapor deposition method and apparatus making use of liquid starting material Grant 5,447,568 - Hayakawa , et al. September 5, 1	1995-09-05
Substrate for recording head, recording head and method for producing same Grant 5,376,231 - Matsumoto , et al. December 27, 1	1994-12-27

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