Hayakawa; Shinichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hayakawa; Shinichi.The latest application filed is for "authentication processing device for performing authentication processing".

Company Profile

0.7.9

Hayakawa; Shinichi - Tokyo JP
Hayakawa; Shinichi - Aichi-ken JP
Hayakawa; Shinichi - Nishikasugai-gun JP
Hayakawa; Shinichi - Aichi JP
Hayakawa; Shinichi - Nagoya-shi JP
Hayakawa; Shinichi - Nagoya JP
Hayakawa, Shinichi - Nagoya-shi Aichi JP
Hayakawa; Shinichi - Seki-City Gifu-Pref. JP
Hayakawa; Shinichi - Seki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Authentication Processing Device For Performing Authentication Processing App 20160092669 - Hayakawa; Shinichi	2016-03-31
Inflator Grant 7,954,848 - Hayakawa , et al. June 7, 2	2011-06-07
Inflator App 20100253053 - Hayakawa; Shinichi ; et al.	2010-10-07
Gas generator Grant 7,780,193 - Hayakawa , et al. August 24, 2	2010-08-24
Gas Generator App 20090230664 - Hayakawa; Shinichi ; et al.	2009-09-17
Gas Generator App 20080217895 - Hayakawa; Shinichi ; et al.	2008-09-11
Adhesive film and method for forming metal film using same App 20070167003 - Saimoto; Yoshihisa ; et al.	2007-07-19
Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film Grant 7,238,421 - Saimoto , et al. July 3, 2	2007-07-03
Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film Grant 7,201,969 - Miyakawa , et al. April 10, 2	2007-04-10
Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same App 20050244631 - Sugimoto, Kosuke ; et al.	2005-11-03
Pressure-sensitive adhesive film for the suface protection of semiconductor wafers and method for protection of semiconductor wafers with the film App 20050203250 - Miyakawa, Masafumi ; et al.	2005-09-15
Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film App 20050161774 - Saimoto, Yoshihisa ; et al.	2005-07-28
Surface protecting adhesive film for semiconductor wafer and protecting method for semiconductor wafer using said adhesive film App 20030064579 - Miyakawa, Masafumi ; et al.	2003-04-03
Screw stopper including anti-freeze device used for water pipe valve Grant 4,932,429 - Watanabe , et al. June 12, 1	1990-06-12
Buckle for a belt Grant 4,529,111 - Hayakawa * July 16, 1	1985-07-16
Multipurpose tool Grant D266,479 - Hayakawa October 12, 1	1982-10-12

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