Hayakawa; Masashi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hayakawa; Masashi.The latest application filed is for "method for producing green compact and method for producing sintered body".
- Hayakawa; Masashi - Nagaokakyo JP
- Hayakawa; Masashi - Kanagawa JP
- Hayakawa; Masashi - Okazaki JP
- HAYAKAWA; Masashi - Nagaokakyo-shi JP
- HAYAKAWA; Masashi - Okazaki-shi JP
- Hayakawa; Masashi - Nagoya N/A JP
- Hayakawa; Masashi - Nagoya-city JP
| Patent | Date |
|---|---|
| Radio-frequency module and communication device Grant 11,456,761 - Hayakawa September 27, 2 | 2022-09-27 |
| Method for Producing Green Compact and Method for Producing Sintered Body App 20220274167 - Morita; Masahiro ; et al. | 2022-09-01 |
| Switching circuit and high frequency module Grant 11,336,278 - Hayakawa May 17, 2 | 2022-05-17 |
| Component-mounting device Grant 11,330,749 - Hayakawa May 10, 2 | 2022-05-10 |
| Radio-frequency Module App 20220038131 - HAYAKAWA; Masashi | 2022-02-03 |
| Radio-frequency Module And Communication Device App 20210384927 - HAYAKAWA; Masashi | 2021-12-09 |
| Radio Frequency Module And Communication Device App 20210376873 - HAYAKAWA; Masashi | 2021-12-02 |
| Radio-frequency module Grant 11,177,850 - Hayakawa November 16, 2 | 2021-11-16 |
| Radio Frequency Module And Communication Device App 20210306024 - HAYAKAWA; Masashi | 2021-09-30 |
| Component mounting device Grant 10,966,358 - Oyama , et al. March 30, 2 | 2021-03-30 |
| Titanium-based Porous Body And Method Of Producing The Same App 20210066723 - HAYAKAWA; Masashi ; et al. | 2021-03-04 |
| Component-mounting Device App 20210007255 - HAYAKAWA; Masashi | 2021-01-07 |
| Die component supply device Grant 10,879,096 - Hayakawa December 29, 2 | 2020-12-29 |
| Radio-frequency Module App 20200235773 - Hayakawa; Masashi | 2020-07-23 |
| Radio-frequency module with switch IC having a ground electrode for isolating between a common terminal and selection terminals Grant 10,651,884 - Hayakawa | 2020-05-12 |
| Die Component Supply Device App 20190355602 - HAYAKAWA; Masashi | 2019-11-21 |
| High-frequency module Grant 10,461,798 - Hayakawa Oc | 2019-10-29 |
| High-frequency Module App 20190140685 - HAYAKAWA; Masashi | 2019-05-09 |
| Circuit module Grant 10,269,500 - Hayakawa | 2019-04-23 |
| High-frequency module Grant 10,014,902 - Hayakawa July 3, 2 | 2018-07-03 |
| Switch module, front-end module, and driving method for switch module Grant 9,941,582 - Hayakawa April 10, 2 | 2018-04-10 |
| Switching Circuit And High Frequency Module App 20170310319 - HAYAKAWA; Masashi | 2017-10-26 |
| High-frequency Module App 20170310355 - HAYAKAWA; Masashi | 2017-10-26 |
| Component Mounting Device App 20170215309 - OYAMA; Shigeto ; et al. | 2017-07-27 |
| Switch Module, Front-end Module, And Driving Method For Switch Module App 20170048859 - HAYAKAWA; Masashi | 2017-02-16 |
| Radio-frequency Module App 20170047963 - HAYAKAWA; Masashi | 2017-02-16 |
| High-frequency module Grant 9,413,413 - Murase , et al. August 9, 2 | 2016-08-09 |
| Method and apparatus for mass-producing DLC films Grant 8,945,690 - Saito , et al. February 3, 2 | 2015-02-03 |
| High-frequency Module App 20140206299 - MURASE; Hisanori ; et al. | 2014-07-24 |
| High-frequency Module App 20130083439 - HAYAKAWA; Masashi | 2013-04-04 |
| High-frequency module and communication apparatus using the module Grant 8,401,495 - Hayakawa March 19, 2 | 2013-03-19 |
| Circuit Module App 20120257323 - HAYAKAWA; Masashi | 2012-10-11 |
| Method and apparatus for mass-producing DLC films App 20090246409 - Saito; Takao ; et al. | 2009-10-01 |
| High-frequency Module And Communication Apparatus Using The Module App 20090185512 - HAYAKAWA; Masashi | 2009-07-23 |
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