HAYAKAWA; Masao

Patent Applications and Registrations

Patent applications and USPTO patent grants for HAYAKAWA; Masao.The latest application filed is for "welding equipment for metallic materials and method for welding metallic materials".

Company Profile

4.17.11

HAYAKAWA; Masao - Ibaraki JP
HAYAKAWA; Masao - Nagakute JP
Hayakawa, Masao - Tokyo JP
Hayakawa; Masao - Kyoto JP
Hayakawa; Masao - Soraku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Welding Equipment For Metallic Materials And Method For Welding Metallic Materials App 20190099829 - KANAI; Takahiko ; et al.	2019-04-04
Welding equipment for metallic materials and method for welding metallic materials Grant 10,189,112 - Kanai , et al. Ja	2019-01-29
Parallel Processing System, Method, And Storage Medium App 20180024862 - NAKAGAWA; Mio ; et al.	2018-01-25
Welding structural part and welding method of the same Grant 9,498,840 - Kanai , et al. November 22, 2	2016-11-22
System, Method And Managing Device App 20160299787 - HAYAKAWA; Masao ; et al.	2016-10-13
Welding Equipment For Metallic Materials And Method For Welding Metallic Materials App 20150306696 - KANAI; Takahiko ; et al.	2015-10-29
Welding equipment for metallic materials and method for welding metallic materials Grant 9,079,266 - Kanai , et al. July 14, 2	2015-07-14
High-strength and high-ductility die-quenched parts and method of manufacturing the same Grant 8,932,416 - Nakanishi , et al. January 13, 2	2015-01-13
Welding Structural Part And Welding Method Of The Same App 20120129006 - Kanai; Takahiko ; et al.	2012-05-24
High-strength And High-ductility Die-quenched Parts And Method Of Manufacturing The Same App 20120118440 - Nakanishi; Eizaburou ; et al.	2012-05-17
Hydrogen Fatigue Resistant Ferritic Steel And Manufacturing Method Thereof App 20110305595 - Matsuoka; Saburo ; et al.	2011-12-15
Welding Equipment For Metallic Materials And Method For Welding Metallic Materials App 20110303655 - Kanai; Takahiko ; et al.	2011-12-15
Flowmeter calibration apparatus App 20020157448 - Hirai, Katahisa ; et al.	2002-10-31
Mass flow control method and device utilizing a sonic nozzle Grant 6,012,474 - Takamoto , et al. January 11, 2	2000-01-11
Method of manufacturing a bump electrode Grant 5,310,699 - Chikawa , et al. May 10, 1	1994-05-10
Plastic encapsulant for semiconductor Grant 4,926,239 - Fujita , et al. May 15, 1	1990-05-15
Method of making a through-hole connector Grant 4,383,363 - Hayakawa , et al. May 17, 1	1983-05-17
Flat shaped semiconductor encapsulation Grant 4,300,153 - Hayakawa , et al. November 10, 1	1981-11-10
Multi-lead frame member with means for limiting mold spread Grant 4,280,132 - Hayakawa , et al. July 21, 1	1981-07-21
Ceramic plate for supporting a semiconductor wafer Grant 4,247,590 - Hayakawa , et al. January 27, 1	1981-01-27
Lead electrode structure for a semiconductor chip carried on a flexible carrier Grant 4,151,543 - Hayakawa , et al. April 24, 1	1979-04-24
Semiconductor device for use in an electronic apparatus having a plurality of circuit boards Grant 4,120,041 - Hayakawa , et al. October 10, 1	1978-10-10

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