Hayakawa; Kazuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hayakawa; Kazuo.The latest application filed is for "email information providing server, email information providing system, email information providing method and email information providing program".

Company Profile

0.9.4

Hayakawa; Kazuo - Tokyo JP
Hayakawa; Kazuo - Gifu JP
Hayakawa; Kazuo - Takasaki JP
Hayakawa; Kazuo - Gunma-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Email information providing server, email information providing system, email information providing method and email information providing program Grant 7,596,604 - Kawakami , et al. September 29, 2	2009-09-29
Molded fiber materials and methods and apparatus for making the same Grant 7,513,967 - Kato , et al. April 7, 2	2009-04-07
Email information providing server, email information providing system, email information providing method and email information providing program App 20070083598 - Kawakami; Nobuo ; et al.	2007-04-12
Information providing server, information providing system, information providing method and information providing program App 20070073714 - Kawakami; Nobuo ; et al.	2007-03-29
Mail processing server, mail processing method, and mail processing program App 20070027918 - Kawakami; Nobuo ; et al.	2007-02-01
Molded fiber materials and methods and apparatus for making the same App 20040026012 - Kato, Takehiro ; et al.	2004-02-12
Recovery of coolant and abrasive grains used in slicing semiconductor wafers Grant 6,001,265 - Toyama , et al. December 14, 1	1999-12-14
Method for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicing Grant 5,937,844 - Kiuchi , et al. August 17, 1	1999-08-17
Wire saw apparatus Grant 5,907,988 - Kiuchi , et al. June 1, 1	1999-06-01
Method of slicing semiconductor single crystal ingot Grant 5,875,769 - Toyama , et al. March 2, 1	1999-03-02
Method for cutting a workpiece with a wire saw Grant 5,839,425 - Toyama , et al. November 24, 1	1998-11-24
Wire saw Grant 5,715,807 - Toyama , et al. February 10, 1	1998-02-10
Cutting fluid, method for production thereof, and method for cutting ingot Grant 5,693,596 - Kaburagi , et al. December 2, 1	1997-12-02

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