Hawkins; George W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hawkins; George W..The latest application filed is for "air-cooled thermal management for a fuel cell stack".

Company Profile

0.13.6

Hawkins; George W. - Portland OR
Hawkins; George W. - South East Bothell WA
Hawkins, George W. - Gilbert AZ
Hawkins, George W - Gilbert AZ
Hawkins; George W. - Mesa AZ
Hawkins; George W. - Midland MI

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Air-cooled thermal management for a fuel cell stack Grant 8,168,344 - Hawkins , et al. May 1, 2	2012-05-01
Air-Cooled Thermal Management for a Fuel Cell Stack App 20100216044 - Hawkins; George W. ; et al.	2010-08-26
Fluid cell system reactant supply and effluent storage cartridges Grant 7,105,245 - Ohlsen , et al. September 12, 2	2006-09-12
Closed liquid feed fuel cell systems and reactant supply and effluent storage cartridges adapted for use with the same App 20040096721 - Ohlsen, Leroy J. ; et al.	2004-05-20
Method and apparatus for performing biological reactions on a substrate surface App 20040018523 - Hawkins, George W.	2004-01-29
Method and apparatus for performing biological reactions on a substrate surface App 20030190744 - McGarry, Mark W. ; et al.	2003-10-09
Compositions and methods for performing biological reactions App 20030157503 - McGarry, Mark W ; et al.	2003-08-21
Compositions and methods for performing biological reactions App 20030134410 - Silva, Robin M. ; et al.	2003-07-17
Method and apparatus for performing biological reactions on a substrate surface Grant 6,589,778 - Hawkins July 8, 2	2003-07-08
Method and apparatus for performing biological reactions on a substrate surface Grant 6,569,674 - McGarry , et al. May 27, 2	2003-05-27
Flexible substrate for packaging a semiconductor component Grant 6,300,679 - Mukerji , et al. October 9, 2	2001-10-09
Method for making a moisture resistant semiconductor device having an organic substrate Grant 5,756,380 - Berg , et al. May 26, 1	1998-05-26
Semiconductor chip bonded to a substrate and method of making Grant 5,385,869 - Liu , et al. January 31, 1	1995-01-31
Method of optimizing the conductivity of a propped fractured formation Grant 5,103,905 - Brannon , et al. April 14, 1	1992-04-14
Semiconductor package having leads that break-away from supports Grant 4,989,069 - Hawkins January 29, 1	1991-01-29
Die corner design having topological configurations Grant 4,928,162 - Lesk , et al. May 22, 1	1990-05-22
Flagless semiconductor package Grant 4,924,291 - Lesk , et al. May 8, 1	1990-05-08
Semiconductor die for plastic encapsulation having an adhesion promoter Grant 4,832,996 - Lesk , et al. May 23, 1	1989-05-23
Rail bonded multi-chip leadframe, method and package Grant 4,740,868 - Hawkins April 26, 1	1988-04-26

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