Hausler; Alfred
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hausler; Alfred.The latest application filed is for "control of dopant diffusion from buried layers in bipolar integrated circuits".
- Hausler; Alfred - Freising DE
- Hausler; Alfred - Meitingen DE
| Patent | Date |
|---|---|
| Control of dopant diffusion from buried layers in bipolar integrated circuits Grant 8,247,300 - Babcock , et al. August 21, 2 | 2012-08-21 |
| Control Of Dopant Diffusion From Buried Layers In Bipolar Integrated Circuits App 20100279481 - Babcock; Jeffrey A. ; et al. | 2010-11-04 |
| Polymer-bonded fiber agglomerate, fiber-reinforced composite material and processes for producing the same App 20060076699 - Domagalski; Peter ; et al. | 2006-04-13 |
| Control of dopant diffusion from buried layers in bipolar integrated circuits App 20050250289 - Babcock, Jeffrey A. ; et al. | 2005-11-10 |
| Control of dopant diffusion from polysilicon emitters in bipolar integrated circuits App 20030080394 - Babcock, Jeffrey A. ; et al. | 2003-05-01 |
| Control of dopant diffusion from buried layers in bipolar integrated circuits App 20030082882 - Babcock, Jeffrey A. ; et al. | 2003-05-01 |
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