loadpatents
name:-0.018183946609497
name:-0.016271114349365
name:-0.00097298622131348
Hauser; Wolfgang Patent Filings

Hauser; Wolfgang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hauser; Wolfgang.The latest application filed is for "electronic component with a leadframe".

Company Profile
0.7.10
  • Hauser; Wolfgang - Endingen DE
  • Hauser; Wolfgang - Rheda-Wiedenbruck DE
  • Hauser; Wolfgang - Endlingen DE
  • Hauser, Wolfgang - Salzgartenstrasse DE
  • Hauser; Wolfgang - Stutensee-Fr. DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electronic component with a leadframe
Grant 9,620,391 - Hauser , et al. April 11, 2
2017-04-11
Electronic Component With A Leadframe
App 20160035594 - HAUSER; Wolfgang ;   et al.
2016-02-04
Method And Apparatus For Drying Workpieces
App 20140173928 - Hauser; Wolfgang
2014-06-26
Integration of SMD components in an IC housing
Grant 8,203,168 - Schinner , et al. June 19, 2
2012-06-19
Probe card assembly
Grant 8,125,234 - Stiefvater , et al. February 28, 2
2012-02-28
Integration Of Smd Components In An Ic Housing
App 20110068460 - SCHINNER; Felix ;   et al.
2011-03-24
Probe card assembly
App 20080303540 - Stiefvater; Gunter ;   et al.
2008-12-11
Integrated circuit with offset pins
Grant 7,414,308 - Hauser , et al. August 19, 2
2008-08-19
Method for testing a chip with a package and for mounting the package on a board
Grant 7,284,321 - Hauser , et al. October 23, 2
2007-10-23
Support device for monolithically integrated circuits
App 20060151772 - Tricomi; Giovanni ;   et al.
2006-07-13
Integrated circuit with offset pins
Grant 7,053,480 - Hauser , et al. May 30, 2
2006-05-30
Method for testing a chip with a package and for mounting the package on a board
App 20060108679 - Hauser; Wolfgang ;   et al.
2006-05-25
Method for testing a chip with a package and for mounting the package on a board
App 20050258849 - Hauser, Wolfgang ;   et al.
2005-11-24
Method for testing a chip with a housing and for placing said housing on the board
App 20050009216 - Hauser, Wolfgang ;   et al.
2005-01-13
An electronic component with a leadframe
App 20040113240 - Hauser, Wolfgang ;   et al.
2004-06-17
Method of making a leach resistant fixation product of harmful water-containing waste and cement
Grant 4,533,395 - Vejmelka , et al. August 6, 1
1985-08-06

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