loadpatents
Patent applications and USPTO patent grants for Hauser; Wolfgang.The latest application filed is for "electronic component with a leadframe".
Patent | Date |
---|---|
Electronic component with a leadframe Grant 9,620,391 - Hauser , et al. April 11, 2 | 2017-04-11 |
Electronic Component With A Leadframe App 20160035594 - HAUSER; Wolfgang ;   et al. | 2016-02-04 |
Method And Apparatus For Drying Workpieces App 20140173928 - Hauser; Wolfgang | 2014-06-26 |
Integration of SMD components in an IC housing Grant 8,203,168 - Schinner , et al. June 19, 2 | 2012-06-19 |
Probe card assembly Grant 8,125,234 - Stiefvater , et al. February 28, 2 | 2012-02-28 |
Integration Of Smd Components In An Ic Housing App 20110068460 - SCHINNER; Felix ;   et al. | 2011-03-24 |
Probe card assembly App 20080303540 - Stiefvater; Gunter ;   et al. | 2008-12-11 |
Integrated circuit with offset pins Grant 7,414,308 - Hauser , et al. August 19, 2 | 2008-08-19 |
Method for testing a chip with a package and for mounting the package on a board Grant 7,284,321 - Hauser , et al. October 23, 2 | 2007-10-23 |
Support device for monolithically integrated circuits App 20060151772 - Tricomi; Giovanni ;   et al. | 2006-07-13 |
Integrated circuit with offset pins Grant 7,053,480 - Hauser , et al. May 30, 2 | 2006-05-30 |
Method for testing a chip with a package and for mounting the package on a board App 20060108679 - Hauser; Wolfgang ;   et al. | 2006-05-25 |
Method for testing a chip with a package and for mounting the package on a board App 20050258849 - Hauser, Wolfgang ;   et al. | 2005-11-24 |
Method for testing a chip with a housing and for placing said housing on the board App 20050009216 - Hauser, Wolfgang ;   et al. | 2005-01-13 |
An electronic component with a leadframe App 20040113240 - Hauser, Wolfgang ;   et al. | 2004-06-17 |
Method of making a leach resistant fixation product of harmful water-containing waste and cement Grant 4,533,395 - Vejmelka , et al. August 6, 1 | 1985-08-06 |
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