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Patent applications and USPTO patent grants for Hauser; John R..The latest application filed is for "three-zone rapid thermal processing system utilizing wafer edge heating means".
Patent | Date |
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Three-zone rapid thermal processing system utilizing wafer edge heating means Grant 5,418,885 - Hauser , et al. May 23, 1 | 1995-05-23 |
Conical rapid thermal processing apparatus Grant 5,253,324 - Wortman , et al. October 12, 1 | 1993-10-12 |
Patterned tunnel junction Grant H667 - Bedair , et al. September 5, 1 | 1989-09-05 |
High impendance-coupled CMOS SRAM for improved single event immunity Grant 4,805,148 - Diehl-Nagle , et al. February 14, 1 | 1989-02-14 |
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