Hauf; Uwe

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hauf; Uwe.The latest application filed is for "aqueous acidic bath for electrolytic deposition of copper".

Company Profile

0.5.6

Hauf; Uwe - Wendestein DE
Hauf; Uwe - Wendelstein N/A DE
Hauf; Uwe - State College PA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Aqueous Acidic Bath for Electrolytic Deposition of Copper App 20140138252 - Dambrowsky; Nina ; et al.	2014-05-22
Vertical system for the plating treatment of a work piece and method for conveying the work piece Grant 8,540,853 - Schneider , et al. September 24, 2	2013-09-24
Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces Grant 7,993,486 - Hauf , et al. August 9, 2	2011-08-09
Vertical System For The Plating Treatment Of A Work Piece And Method For Conveying The Work Piece App 20100200410 - Schneider; Reinhard ; et al.	2010-08-12
Device and method for drying a treated product App 20070107256 - Wiener; Ferdinand ; et al.	2007-05-17
Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces App 20070012560 - Hauf; Uwe ; et al.	2007-01-18
Acidic treatment liquid and method of treating copper surfaces Grant 7,153,449 - Hauf , et al. December 26, 2	2006-12-26
Process for the preliminary treatment of copper surfaces Grant 6,723,385 - Grieser , et al. April 20, 2	2004-04-20
Acidic treatment liquid and method of treating copper surfaces App 20030164466 - Hauf, Uwe ; et al.	2003-09-04

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