Haubold; Marco

Patent Applications and Registrations

Patent applications and USPTO patent grants for Haubold; Marco.The latest application filed is for "method for wafer bonding and compound semiconductor wafer".

Company Profile

5.4.6

Haubold; Marco - Dresden DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for producing a moisture sensor at the wafer level and moisture sensor Grant 11,428,661 - Haubold , et al. August 30, 2	2022-08-30
Method For Wafer Bonding And Compound Semiconductor Wafer App 20220238501 - Hampl; Stefan ; et al.	2022-07-28
Stressed decoupled micro-electro-mechanical system sensor Grant 10,870,575 - Theuss , et al. December 22, 2	2020-12-22
Method for Producing a Moisture Sensor at the Wafer Level and Moisture Sensor App 20200166471 - Haubold; Marco ; et al.	2020-05-28
Stressed Decoupled Micro-electro-mechanical System Sensor App 20200002159 - THEUSS; Horst ; et al.	2020-01-02
Pressure sensor device and manufacturing method Grant 10,386,255 - Kautzsch , et al. A	2019-08-20
Semiconductor device, pressure sensor, microphone, and acceleration sensor Grant 10,329,140 - Haubold , et al.	2019-06-25
Semiconductor Device, Pressure Sensor, Microphone, Acceleration Sensor And Method For Forming A Semiconductor Device App 20180222744 - Haubold; Marco ; et al.	2018-08-09
Pressure Sensor Device And Manufacturing Method App 20180017456 - Kautzsch; Thoralf ; et al.	2018-01-18
Damping of a Sensor App 20180003503 - Haubold; Marco	2018-01-04

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