| Patent | Date |
|---|
Land Grid Based Multi Size Pad Package
App 20190043817 - KADADE; Manoj ; et al. | 2019-02-07 |
Layout Construction For Addressing Electromigration
App 20180211957 - RASOULI; Seid Hadi ; et al. | 2018-07-26 |
Land Grid Based Multi Size Pad Package
App 20180053740 - KAKADE; Manoj ; et al. | 2018-02-22 |
Copper interconnects with improved electromigration lifetime
Grant 8,723,321 - Woo , et al. May 13, 2 | 2014-05-13 |
Method for quantitative detection of multiple electromigration failure modes
Grant 7,818,655 - Lee , et al. October 19, 2 | 2010-10-19 |
Integrated circuit design system
Grant 7,451,411 - Hau-Riege , et al. November 11, 2 | 2008-11-11 |
Integrated circuit design system
App 20070300200 - Hau-Riege; Christine ; et al. | 2007-12-27 |
Copper interconnects with improved electromigration lifetime
App 20070284748 - Woo; Christy ; et al. | 2007-12-13 |
Method And Test Structure For Estimating Electromigration Effects Caused By Porous Barrier Materials
App 20070278484 - Feustel; Frank ; et al. | 2007-12-06 |
Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability
Grant 7,153,774 - Hau-Riege , et al. December 26, 2 | 2006-12-26 |
Semiconductor component and method for precluding stress-induced void formation in the semiconductor component
Grant 7,026,225 - Hau-Riege , et al. April 11, 2 | 2006-04-11 |
Wafer-bonding using solder and method of making the same
Grant 6,870,262 - Hau-Riege , et al. March 22, 2 | 2005-03-22 |
System and method for current-enhanced stress-migration testing of interconnect
Grant 6,867,056 - Hau-Riege , et al. March 15, 2 | 2005-03-15 |
Determination of permeability of layer material within interconnect
Grant 6,822,473 - Hau-Riege , et al. November 23, 2 | 2004-11-23 |
Interconnect test structure with slotted feeder lines to prevent stress-induced voids
Grant 6,822,437 - Hau-Riege , et al. November 23, 2 | 2004-11-23 |
Method of forming SiC capped copper interconnects with reduced hillock formation and improved electromigration resistance
Grant 6,818,557 - Ngo , et al. November 16, 2 | 2004-11-16 |
System and method for determining location of extrusion in interconnect
Grant 6,768,323 - Hau-Riege , et al. July 27, 2 | 2004-07-27 |
Structure, system, and method for assessing electromigration permeability of layer material within interconnect
Grant 6,762,597 - Hau-Riege , et al. July 13, 2 | 2004-07-13 |
Method for assessing the reliability of interconnects
Grant 6,725,433 - Hau-Riege , et al. April 20, 2 | 2004-04-20 |
Methodology for an assessment of the degree of barrier permeability at via bottom during electromigration using dissimilar barrier thickness
Grant 6,714,037 - Hau-Riege , et al. March 30, 2 | 2004-03-30 |
Wafer-bonding using solder and method of making the same
App 20040056073 - Hau-Riege, Stefan ; et al. | 2004-03-25 |
Wafer-bonding using solder and method of making the same
Grant 6,667,225 - Hau-Riege , et al. December 23, 2 | 2003-12-23 |
Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability
App 20030228753 - Hau-Riege, Stefan ; et al. | 2003-12-11 |
Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability
App 20030194857 - Hau-Riege, Stefan ; et al. | 2003-10-16 |
Wafer-bonding using solder and method of making the same
App 20030113976 - Hau-Riege, Stefan ; et al. | 2003-06-19 |
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