HATTORI; Takahiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for HATTORI; Takahiro.The latest application filed is for "building material manufacturing apparatus".
Company Profile
6.20.26
- HATTORI; Takahiro - Nagoya-shi JP
- HATTORI; Takahiro - Tokyo JP
- Hattori; Takahiro - Tochigi JP
- Hattori; Takahiro - Tochigi-ken JP
- HATTORI; Takahiro - US
- Hattori; Takahiro - Kyoto N/A JP
- Hattori; Takahiro - Fukui JP
- Hattori; Takahiro - Shiga JP
- HATTORI; TAKAHIRO - Ichihara-shi JP
- Hattori; Takahiro - Chiba JP
- Hattori; Takahiro - Nishio JP
- Hattori; Takahiro - Okazaki JA
Patent Activity
| Patent | Date |
|---|---|
| Building Material Manufacturing Apparatus App 20220143866 - HATTORI; Takahiro ; et al. | 2022-05-12 |
| Method For Forming Bump Electrode Substrate App 20210387276 - HATTORI; Takahiro ; et al. | 2021-12-16 |
| Solder alloy, solder ball, chip solder, solder paste, and solder joint Grant 10,773,345 - Tachibana , et al. Sept | 2020-09-15 |
| Solder material, solder paste, solder preform, solder joint and method of managing the solder material Grant 10,717,157 - Hattori , et al. | 2020-07-21 |
| Flux composition for solder applications Grant 10,610,979 - Maruko , et al. | 2020-04-07 |
| Solder Material, Solder Paste, Formed Solder And Solder Joint App 20200061757 - NISHINO; Tomoaki ; et al. | 2020-02-27 |
| Core material, semiconductor package, and forming method of bump electrode Grant 10,381,319 - Nishino , et al. A | 2019-08-13 |
| Cu core ball, solder paste, formed solder, Cu core column, and solder joint Grant 10,322,472 - Hattori , et al. | 2019-06-18 |
| Solder Alloy, Solder Ball, Chip Solder, Solder Paste, and Solder Joint App 20190070696 - Tachibana; Ken ; et al. | 2019-03-07 |
| Flux App 20180339375 - Maruko; Daisuke ; et al. | 2018-11-29 |
| Core Material, Semiconductor Package, and Forming Method of Bump Electrode App 20180174991 - Nishino; Tomoaki ; et al. | 2018-06-21 |
| Solder Material, Solder Paste, Solder Preform, Solder Joint and Method of Managing the Solder Material App 20170312860 - Hattori; Takahiro ; et al. | 2017-11-02 |
| Solder Alloy, Solder Ball, Chip Solder, Solder Paste and Solder Joint App 20170216975 - TACHIBANA; Ken ; et al. | 2017-08-03 |
| Bump electrode, board which has bump electrodes, and method for manufacturing the board Grant 9,662,730 - Hattori , et al. May 30, 2 | 2017-05-30 |
| Cu ball Grant 9,668,358 - Kawasaki , et al. May 30, 2 | 2017-05-30 |
| Cu Core Ball, Solder Paste, Formed Solder, Cu Core Column, and Solder Joint App 20160368105 - Hattori; Takahiro ; et al. | 2016-12-22 |
| Signboard device Grant 9,418,578 - Hattori August 16, 2 | 2016-08-16 |
| A Signboard Device App 20160078789 - HATTORI; Takahiro | 2016-03-17 |
| Cu BALL App 20150336216 - HATTORI; Takahiro ; et al. | 2015-11-26 |
| Cu BALL App 20150313025 - KAWASAKI; Hiroyoshi ; et al. | 2015-10-29 |
| Bump Electrode, Board Which Has Bump Electrodes, and Method for Manufacturing the Board App 20150061129 - Hattori; Takahiro ; et al. | 2015-03-05 |
| Bus bar, motor, and process for producing these Grant 8,922,080 - Nakagawa , et al. December 30, 2 | 2014-12-30 |
| Copolymerized polyether polyamide resin Grant 8,541,321 - Hagiwara , et al. September 24, 2 | 2013-09-24 |
| Bus Bar, Motor, And Process For Producing These App 20130181569 - Nakagawa; Airi ; et al. | 2013-07-18 |
| Fabric for airbag Grant 7,994,076 - Kano , et al. August 9, 2 | 2011-08-09 |
| Woven fabric for airbag Grant 7,985,702 - Kano , et al. July 26, 2 | 2011-07-26 |
| Woven Fabric For Airbag App 20110097955 - Kano; Kenichiro ; et al. | 2011-04-28 |
| Fabric for Airbag App 20110097956 - Kano; Kenichiro ; et al. | 2011-04-28 |
| Copolymerized Polyether Polyamide Resin App 20110014833 - Hagiwara; Hiroaki ; et al. | 2011-01-20 |
| Fabric For Airbag App 20100282358 - Kano; Kenichiro ; et al. | 2010-11-11 |
| Resolver, manufacturing method thereof, and motor using the resolver Grant 7,830,051 - Kataoka , et al. November 9, 2 | 2010-11-09 |
| Woven Fabric For Airbag App 20100260976 - Kano; Kenichiro ; et al. | 2010-10-14 |
| Oxetane-containing Resin, As Well As An Adhesive And A Resist Agent Using The Same App 20100069599 - Yatsuka; Takeshi ; et al. | 2010-03-18 |
| Resolver, Manufacturing Method Thereof, And Motor Using The Resolver App 20080169714 - Kataoka; Nakaba ; et al. | 2008-07-17 |
| Light Reflective Sheet App 20070229956 - SAKAMOTO; HIDESHI ; et al. | 2007-10-04 |
| Process for the preparation of fiber-filled thermoplastic resin composition Grant 6,676,870 - Hattori , et al. January 13, 2 | 2004-01-13 |
| Heat-sensitive recording material Grant 6,596,668 - Kuroda , et al. July 22, 2 | 2003-07-22 |
| Heat-sensitive recording material App 20020198105 - Kuroda, Takashi ; et al. | 2002-12-26 |
| Switch device and overcurrent controlling method App 20020015272 - Hattori, Takahiro | 2002-02-07 |
| Turret head unit Grant 4,922,595 - Hattori , et al. May 8, 1 | 1990-05-08 |
| Process And Apparatus For Drying Porous Material Grant 3,858,329 - Koide , et al. January 7, 1 | 1975-01-07 |
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