Hattori; Nao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hattori; Nao.The latest application filed is for "workpiece dividing method".
- Hattori; Nao - Tokyo JP
| Patent | Date |
|---|---|
| Method of processing a substrate Grant 10,727,127 - Morikazu , et al. | 2020-07-28 |
| Substrate processing method Grant 10,702,946 - Morikazu , et al. | 2020-07-07 |
| Workpiece dividing method Grant 10,580,697 - Hattori | 2020-03-03 |
| Workpiece dividing method Grant 10,535,565 - Hattori Ja | 2020-01-14 |
| Workpiece Dividing Method App 20190051561 - Hattori; Nao | 2019-02-14 |
| Workpiece Dividing Method App 20180301378 - Hattori; Nao | 2018-10-18 |
| Method Of Processing A Substrate App 20180204771 - Morikazu; Hiroshi ; et al. | 2018-07-19 |
| Substrate Processing Method App 20180161921 - Morikazu; Hiroshi ; et al. | 2018-06-14 |
| Method of processing a substrate Grant 9,831,128 - Morikazu , et al. November 28, 2 | 2017-11-28 |
| Method of forming gettering layer Grant 9,721,809 - Morikazu , et al. August 1, 2 | 2017-08-01 |
| Method Of Processing A Substrate App 20170076983 - Morikazu; Hiroshi ; et al. | 2017-03-16 |
| Workpiece processing method Grant 9,576,835 - Wei , et al. February 21, 2 | 2017-02-21 |
| Workpiece Processing Method App 20150136312 - Wei; Frank ; et al. | 2015-05-21 |
| Method Of Forming Gettering Layer App 20140080289 - Morikazu; Hiroshi ; et al. | 2014-03-20 |
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