Hatao; Takuya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hatao; Takuya.The latest application filed is for "connecting structure for flip-chip semiconductor package, build-up layer material, sealing resin composition, and circuit board".
- Hatao; Takuya - Utsunomiya JP
- Hatao; Takuya - Tochigi JP
- Hatao; Takuya - Kawasaki JP
| Patent | Date |
|---|---|
| Connecting structure for flip-chip semiconductor package, build-up layer material, sealing resin composition, and circuit board Grant 7,893,542 - Tachibana , et al. February 22, 2 | 2011-02-22 |
| Connecting Structure For Flip-chip Semiconductor Package, Build-up Layer Material, Sealing Resin Composition, And Circuit Board App 20090273073 - Tachibana; Kenya ; et al. | 2009-11-05 |
| Polybenzoxazole resin and precursor thereof Grant 6,297,351 - Murayama , et al. October 2, 2 | 2001-10-02 |
| Polybenzoxazole resin and precursor thereof Grant 6,114,497 - Tada , et al. September 5, 2 | 2000-09-05 |
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